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A device pad structure is shown next to a penny for
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A device pad structure is shown next to a penny for comparative size.

May 13, 2010
A device pad structure is shown next to a penny for comparative size. The Georgia Tech Center for Low Cost Packaging Research (PRC) envisions those future devices, such as ICs, MEMS, and integral passives, will be embedded in the substrate via SOP (system-on-package) enabling technologies. Research at PRC is funded by the National Science Foundation Engineering Research Centers Program, the electronics industry and the state of Georgia.


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