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Last updated on April 23, 2014 at 21:24 EDT

Nestle Featured at Packaging Event

March 14, 2012

BETHESDA, Md., March 14, 2012 /PRNewswire/ — Stephen P. Klump, Nestle Quality Assurance Center, is headlining a special day of presentations on the fast emergence of energy saving and environmentally proactive UV (ultraviolet) and EB (electron beam) technologies in Printing and Packaging applications at RadTech 2012, April 30 in Chicago, IL. At the event, Dr. Klump will address Nestle’s Approach to Packaging Safety and Compliance: Nestle Inks Guidance Document and the Suisse Ordinance on Inks. In addition to Dr. Klump, issues presented at the event include global and regional regulatory requirements, flexible packaging, and new materials and processes. RadTech 2012 also features a technology exhibition and special sessions on sustainability, LEDs, and Printing Chemical, Biochemical, and Biological Activities in Energy Curable Resins. End users of UV and/or EB may be eligible for discounted or free admission to the event. For details, please visit: http://www.radtech2012.com, www.radtech.org.

RadTech International North America is the nonprofit trade organization dedicated to the advancement of UV and EB technologies. RadTech serves as an industry forum, addressing the educational needs of users and suppliers of UV and EB equipment and materials.

Contact:
RadTech International North America
Mickey Fortune
mickey@radtech.org
(240) 497-1242

SOURCE RadTech International North America


Source: PR Newswire