Micross Components Becomes Worldwide Distributor for GeneSiC Semiconductor Bare Die
ORLANDO, Fla. and DULLES, Va., May 2, 2012 /PRNewswire/ — Micross Components, a global provider of distributed and specialty electronic components, and GeneSiC Semiconductor, a pioneer and world leader in Silicon Carbide (SiC) technology, announce an agreement establishing Micross as an authorized supplier of GeneSiC’s bare die products worldwide. The driving force behind the agreement is the shared commitment of both companies to increase the availability of SiC bare die to industrial, military, aerospace, and energy (particularly, drilling and exploration) customers.
For years, Silicon has been the building block of semiconductor design and fabrication because of its natural abundance, processing ease and relatively useful, although limited, temperature range. SiC, which is a manmade compound, offers enhanced performance, a broader temperature range, greater reliability, and natural radiation resistance. Until recently, challenges and costs associated with SiC production had limited its use among semiconductor manufacturers, but GeneSiC, with its design and fabrication advances, has successfully increased yields. This has resulted in more competitive pricing and offerings, such as GeneSiC’s Schottky diodes, which offer significant design and performance advantages.
Extending those advantages to bare die customers will be Micross’ role under the new agreement. As the leading independent distributor of die products worldwide, Micross has both the product and assembly expertise required to certify the GeneSiC bare die for high-temp/high-reliability applications, as well as the sales channels needed to reach potential customers around the globe. Further, with its technical knowledge and resources, Micross can provide long-term product support to all die customers.
“This agreement is a natural fit,” says GeneSiC’s Chief Business Development Officer, Michael DiGangi. “With Micross’ marketing and product support, we can confidently grow this part of our business, knowing that our die customers will be served in a manner second to none.” Tony Hamby, Micross’ General Manager for Die Distribution in the US, shares DiGangi’s enthusiasm for the new relationship and explains, “Having GeneSiC as a technology partner will be a great advantage for our customers, who, by virtue of their specialty applications, are always pushing performance limits, just like GeneSiC.”
About GeneSiC Semiconductor
GeneSiC Semiconductor, Inc., develops widebandgap semiconductor devices for high temperature, radiation, and power grid applications. This includes development of rectifiers, power switches, and bipolar devices. GeneSiC uses a unique and extensive suite of semiconductor design, fabrication, characterization and testing facilities for such devices. GeneSiC capitalizes on its core competency in device and process design to develop the best possible SiC devices for its customers. The company distinguishes itself by providing high quality products for a wide range of high volume markets. GeneSiC has prime/sub-contracts from major US Government agencies including ARPA-E, US Dept. of Energy, Navy, Army, NASA, DARPA, Dept. of Homeland Security, Dept. of Commerce and other departments within the US Dept. of Defense. To find out more, please visit www.genesicsemi.com.
About Micross Components
Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high-reliability and state-of-the-art electronics, Micross’ solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 30+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish. For more information, visit www.micross.com.
SOURCE Micross Components