KEMET Introduces Tantalum High Volumetric Efficiency Facedown MnO2 Technology
GREENVILLE, S.C., May 16, 2012 /PRNewswire/ — KEMET Corporation (NYSE: KEM), a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today introduced its new Tantalum High Volumetric Efficiency (HVE) Facedown MnO(2) T428 Series capacitors. These surface mountable devices are the latest addition to KEMET’s High Reliability Commercial Off-The-Shelf (COTS) family and offer increased power dissipation and enhanced ripple current capability.
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“This new package design offers the highest capacitance per volume of any molded leadframe product,” said Dr. Philip Lessner, KEMET Vice President, Chief Technology Officer and Chief Scientist. “It provides a broader, more direct path for heat to be dissipated through the capacitor than traditional construction. Additionally, the facedown construction offers higher power ratings per volume.”
“KEMET’s T428 Series was developed to provide the volumetric efficiency of a conformally coated capacitor in a pick-and-place friendly molded package,” said Ed Jones, KEMET Product Manager, Specialty Tantalum Capacitors. “The planarity of the molded package eliminates potential issues associated with conformally coated tantalum surface mount devices.”
The robust design features and testing protocol make this product ideal for use in the computer, industrial/lighting, telecommunications, defense and aerospace markets. Its performance characteristics are ideal for various high reliability applications such as decoupling and filtering in radar and switch mode power supplies.
KEMET’s common stock is listed on the NYSE under the symbol “KEM.” At the Investor Relations section of our web site at http://ir.kemet.com/, users may subscribe to KEMET news releases and find additional information about our Company. KEMET applies world class service and quality to deliver industry leading, high performance capacitance solutions to its customers around the world and offers the world’s most complete line of surface mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics. Additional information about KEMET can be found at http://www.kemet.com.
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Dean W. Dimke
Director of Corporate and Investor Communications
SOURCE KEMET Corporation