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Quality Process Equipment Manufacturer, Yield Engineering Systems, Inc. (YES), Exhibiting at Wafer Level Packaging Tradeshow in May

April 30, 2013

Yield Engineering Systems, Inc. announced they are exhibiting at ECTC.

Livermore, CA (PRWEB) April 30, 2013

Yield Engineering Systems, Inc. (YES) announced today that they will be exhibiting at The 63rd Electronic Components and Technology Conference (ECTC) being held at The Cosmopolitan of Las Vegas in Las Vegas, Nevada on May 29-30, 2013. YES will be located at booth 209.

ECTC is an international packaging, components, and microelectronics systems technology conference which offers attendees an outstanding array of packaging technology information.

During ECTC, YES will be highlighting its high reliability tools for Wafer Level Packaging (WLP) type processes with a low-cost of ownership. The YES-VertaCure and the YES-450PB Series provide a critical component which allows for optimally imidized polymer dielectric in WLP/RDL manufacturing in half the time and expense of atmospheric processes.

“The YES-VertaCure Series is our newest line of tools, and we are excited that MEMS manufacturers are taking an interest,” said Bill Moffat, Founder and CEO, “The YES-VertaCure helps to create a high-reliability MEMS package and to extend the life of the MEMS device.”

For more information regarding the YES-VertaCure or YES-450PB Series, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.

About Yield Engineering Systems, Inc.

YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, WLP, FPD, MEMS, medical, nanotech industries and more.

They manufacture high temperature vacuum cure ovens, vapor deposition systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.

For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2013/4/prweb10681786.htm


Source: prweb



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