Diamond Materials for Semiconductor Applications Report

April 10, 2014

DUBLIN, April 10, 2014 /PRNewswire/ –

Research and Markets (
http://www.researchandmarkets.com/research/d2ct54/diamond_materials) has announced the
addition of the “Diamond Materials for Semiconductor Applications Report”
[http://www.researchandmarkets.com/research/d2ct54/diamond_materials ] report to their
offering. <start_newscom>

(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

$43M diamond material market in 2020 will be driven mainly by passive devices

Diamond materials have been in development for more than 50 years. Besides the
traditional tooling applications (drilling, cutting), the interest in diamond continues to
grow for optical and thermal applications, and for new applications in semiconductor
devices such as high-power devices and high-frequency devices able to work at elevated

In fact, diamond’s unique physical and electrical properties, which include: the
highest known thermal conductivity, a wide band gap, excellent electrical insulator
properties, very high breakdown voltage and very high carrier mobility, make diamond an
excellent candidate for electronic devices with ultimate performance.

However, the costs of diamond, as well as the remaining technology barriers limit the
diamond material [http://www.researchandmarkets.com/research/d2ct54/diamond_materials ]
market to only a few applications and some high-end devices.

Both passive (heat spreaders) and active (diodes, transistors) diamond solutions are
considered in the market quantification.

Despite the high costs of high-quality materials, a large number of players are
involved in the 2013 diamond materials market and its largest segment – R&D activities.
Two scenarios for 2013-2020 diamond material market growth are presented in the report.
According to the base scenario, the diamond materials market for semiconductor devices
will surpass $43M and will be represented mainly by heat spreaders used in high-power
device thermal management.

Access to high-quality diamond material is key for diamond device development

Electronic applications, such as Schottky diodes, transistors, etc., require
high-quality single-crystalline CVD diamond, which has superior characteristics such as
high carrier mobility, long carrier lifetimes, high breakdown fields and high thermal

High quality low-defect diamond wafers produced from diamond crystal made by
High-Pressure High-Temperature
[http://www.researchandmarkets.com/research/d2ct54/diamond_materials ] (HPHT) method are
only a few mm in size. In comparison, the competing semiconductor materials such as SiC
are already available in wafer sizes up to 150 mm. For future diamond-based active
devices, it is crucial to increase the wafer size above 2-inch with the defect density 100
cm-2 and below. Different approaches to achieve free-standing wafers from thick diamond
films are under development. A mosaic type method is currently approaching 2-inch wafer
size, but the defect density needs to be reduced. According to our technology roadmap for
single crystal diamond wafers, low-defect 2-inch wafers can be commercially available
around 2016-2017.

Key Topics Covered:

1. Glossary

2. Objectives of the report

3. Executive summary

4. Introduction

5. Noteworthy news

6. Introduction to diamond material

7. Diamond applications in electronic devices

8. Diamond heat spreader

9. GaN on diamond

10. Cost of diamond materials

11. Diamond material market forecast

12. Diamond crystal and film growth

13. Diamond wafer fabrication from a single crystal

14. Diamond film growth

15. Supply chain

16. Diamond R&D and technology roadmap

17. Company and R&D institution profiles


Companies Mentioned:

        - AIST
        - AKHAN Technologies
        - Adamas BSU
        - Advanced Diamond Technologies (ADT)
        - Aixtron
        - Blue Wave Semiconductors
        - CEA
        - CNRS
        - Carat Systems
        - Cornes Technologies (SEKI Diamond)
        - DRL
        - De Beers Group
        - Diamond Materials GmbH
        - EDP Corp.
        - Element Six (E6)
        - Evince Technology
        - Fraunhofer IAF
        - Gemesis
        - Group4 Labs
        - IIa Technologies
        - INEX Newcastle University
        - Lockheed Martin
        - Luoyang Aimeil Diamond
        - Microwave Enterprises
        - NTT
        - NeoCoat
        - Nitronex
        - Oak Ridge National Laboratory
        - Oxford Lasers
        - Plassys-Bestek
        - Quantum Communications Victoria
        - RFHIC
        - Raytheon
        - Scio Diamond Technology
        - Sumitomo Electric
        - TriQuint Semiconductor
        - University of Augsburg
        - University of Bristol
        - Washington Diamonds
        - iplas
        - sp3 Diamond Technologies

For more information visit


Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets

Source: PR Newswire

comments powered by Disqus