Advanced Micro-Fabrication Equipment, Inc. Closes Series D Round With $46 Million in Additional Financing

March 10, 2010

SHANGHAI, and SAN FRANCISCO, March 10 /PRNewswire-Asia/ — Advanced
Micro-Fabrication Equipment, Inc. (http://www.amec-inc.com/ ) (AMEC) today
announced that it has closed its Series D financing round by securing $46
from existing investors. They include: Shanghai Venture Capital Co.
Ltd. (http://www.shvc.com.cn/ ), Walden International
(http://www.waldenintl.com/ ), Lightspeed Venture Partners
(http://www.lightspeedvp.com/ ), Goldman Sachs (http://www.goldmansachs.com/ ),
Redpoint Ventures (http://www.redpoint.com/ ), Global Catalyst Partners
(http://www.gc-partners.com/ ), InterWest Partners
(http://www.interwest.com/ ), Bay Partners (http://www.baypartners.com/ ) and
Qualcomm Ventures (http://www.qualcomm.com/ventures ).

Since its inception in 2004, the company has raised more than $150 million
from venture capital sources.

“I am very pleased that AMEC held its ground during the severe economic
crisis and semiconductor industry downturn,” said Pingao Wang, President of
Shanghai Venture Capital Co. Ltd. “The company has made major progress in
plasma Etch equipment development and achieved good product positioning
momentum. At the same time, they have played a leading role in the development
of China’s semiconductor equipment industry. Looking ahead, I believe that
AMEC is very well positioned to ramp up volume production and provide the best
equipment solution along with excellent technical support to IC makers.
Shanghai Venture Capital Co. Ltd. will continue to support AMEC’s execution of
its business and technology strategy.”

Lip- Bu Tan, Chairman of Walden International, noted, “As the semiconductor
industry moves to advanced device nodes (32/22-nm process), foundries are
expanding capacity to keep pace with stringent new technology requirements.
AMEC raised sufficient capital to build a tool that offers the best
performance, highest yield and lowest cost of operation for this advanced
production environment. I’m confident that the management team will rise to
the challenge and help the industry meet the new demands.”

“AMEC’s management team continued to execute on its business plan through
the downturn and has emerged with a compelling offering at a time when capital
equipment demand is growing,” said Chris Schaepe, Managing Director of
Lightspeed Venture Partners. “The steady adoption of the company’s technology
by leading chipmakers is very encouraging, as is the company’s product roadmap.
We look forward to AMEC’s continued growth as the industry rebounds and demand
for the company’s differentiated Etch product continues to rise.”

“The financing provides extra bandwidth to further position our product
and accelerate volume production,” said AMEC’s Chairman and CEO, Dr. Gerald Z.
. “Despite tight capital markets and a generally difficult environment for
start-ups, we kept our aggressive innovation initiatives on track. This
enabled us to deliver a best-in-class plasma Etch tool to customers working on
very advanced devices. With its industry-leading productivity, performance and
cost advantages, the tool has gained a strong foothold in fabs across Asia.
We’re grateful to our investors and customers for their confidence and
continued support.”

Since the last funding round, AMEC has focused on positioning its Primo
D-RIE(TM) Etch tool at customer sites. Today, five companies in Asia have
installed the system. They include foundries and memory IC companies
fabricating devices at nodes of 65 nm and 45 nm, with extendibility to 32 nm
and beyond. Repeat orders have already been received and smooth system
start-ups are underway at the customers’ respective fabs. Additional tools are
slated for delivery throughout 2010. Some will go to existing customers for
volume-production; others are bound for new customers.

Chipmakers are drawn to the PRIMO D-RIE system for its novel architecture
– a cluster tool with a dual-station chamber with single-station independent
control — along with its very high radio frequency Decoupled Reactive Ion
Etch (D-RIE) technology. When combined with superior engineering design and
high-quality manufacturing, these features make AMEC’s Primo D-RIE one of the
most productive, reliable and cost-efficient Etch tools on the market. Last
year, the system received the 2009 Best Product Award from leading US trade
publication, Semiconductor International. In addition, AMEC and its technology
received nine other regional awards during this time.

Other recent corporate developments include the settlement of all
outstanding disputes with Applied Materials, with a mutual commitment to
evaluate collaboration opportunities.

About Advanced Micro-Fabrication Equipment, Inc.

Advanced Micro-Fabrication Equipment, Inc. (AMEC) is a leading Asia-based
semiconductor equipment company with proprietary wafer fabrication solutions
designed to advance technology, increase productivity and reduce manufacturing
costs for leading global semiconductor manufacturers. AMEC’s systems combine
unique technology solutions with economic innovations for the 65- 45- and 32-
nm nodes and beyond. The company maintains R&D, manufacturing, business and
support operations in China, with sales and support organizations in Japan,
Korea, Singapore and Taiwan. To learn more, please visit
http://www.amec-inc.com .

Primo D-RIE is a registered trademark of AMEC.

SOURCE Advanced Micro-Fabrication Equipment, Inc.

Source: newswire

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