FlipChip International and Fujikura Forge Partnership for Advanced Semiconductor Packaging Technologies
TOKYO, June 13, 2011 /PRNewswire/ — Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation semiconductor packaging technology. FCI and Fujikura have agreed to partner on the further development and commercialization of next generation semiconductor packaging including flexible substrate based embedded die, Fan-Out packages, and high density, 3D interposer technologies.
Bob Forcier, Chief Executive Office at Flip Chip International, said, “Fujikura is a recognized global leader in interconnect technologies ranging from optical connection to high speed copper interconnects. Fujikura Limited has a powerful technology roadmap which complements perfectly with FCI’s product roadmap. We feel privileged to have them as a partner.”
Takamasa Kato, Executive Vice President & Member of the Board of Fujikura, said, “FCI is a world leading WLCSP and bumping supplier and have a great deal of experience and aggressive programs of future business in the semiconductor packaging field. We consider that FCI is the most reliable partner for us to co-operate in this exciting field.”
FlipChip International, LLC is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. FlipChip International is a recognized leader in WLCSP and flip chip bumping. FlipChip International, LLC is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets. For more information, visit www.flipchip.com.
Fujikura Limited is a global supplier of optical transmissions systems, network systems, electronic materials, power systems, coated wires, magnet wires, electronic materials for equipment and metallic materials. For 120 years, Fujikura has been providing “Tsunagu” (connection) technologies. For more information, visit www.fujikura.com.
SOURCE FlipChip International, LLC