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Printed Electronics Version 3.0: A Market Forecast

March 21, 2013

DUBLIN, Ireland, March 21, 2013 /PRNewswire/ –

Research and Markets [http://www.researchandmarkets.com/research/r9tl3m/printed ] has
announced the addition of the “Printed Electronics Version 3.0: A Market Forecast”
[http://www.researchandmarkets.com/research/r9tl3m/printed ] report to their offering.

(Logo:
http://photos.prnewswire.com/prnh/20130307/600769 )

The report quantifies these opportunities in terms of revenues generated by PE V3.0 at
three levels of the value chain. In addition, to an eight-year forecast of PE-enabled
products, the report also contains projections of PE components and specialist inks. The
components covered are thin-film transistors, memories, batteries, sensors, displays and
lighting.

The organizations discussed include:

        - Agilent
        - Bank of America
        - Bemis
        - DuPont Teijin
        - eBay
        - Enfucell
        - Esquire Magazine
        - Fujifilm Dimatix
        - GE
        - Gemalto
        - Jenn Feng
        - Kovio
        - MasterCard
        - Merck
        - Mitsubishi
        - Panasonic
        - Nanosolar
        - Oxford Photovoltaics
        - PARC
        - Pioneer
        - PolyIC
        - PragmaticIC
        - Pragmatic Printing
        - Plastic Logic
        - Printed Electronics Limited
        - Samsung
        - Seiko Epson
        - Thin Film Electronics
        - Tokyo Electron
        - UDC.

Key Topics Covered:

Chapter One: Printed Electronics V3.0: A Summary of Opportunities

        1.1 Printing as Strategy and Printing as Tactics: An Approach to Market Segmentation
        1.2 Objectives and Coverage of this Report
        1.3 Printed Electronics: The First Two Phases and their Consequences

        1.4 Printed Electronics V3.0: The New PE
        1.5 Short-to-Medium Term Applications for Printed Electronics

        1.6 Longer-Term Opportunities for PE V3.0

        1.7 Supply Chain and Ecosystem Opportunities
        1.8 Opportunities for the Printing/Printing Equipment Industry: Printing Electronics
         Isn't As Easy as it Looks!
        1.9 Eight-Year Forecasts of Products Enabled by PE V3.0

Chapter Two: Technology Enablers and Components for the “New” Printed Electronics

        2.1 Printed Electronic Components: Mostly Still Evolving

        2.2 Printed Electronics in Packaging: Why Packaging Must Become Smart

        2.3 A Growing Need for Powered Smart Cards

        2.4 PE Innovations for Medical Devices and Disposables

        2.5 Interactive Printed Media and Disposable Electronics

        2.6 Printed Displays for Mobile Devices and Televisions

        2.7 Printed OLED Lighting
        2.8 Printed Solar Cells
        2.9 Summary of PE V3.0 Components Forecasts

Chapter Three: Opportunities for Inks and Other Key Materials for the New Printed
Electronics

        3.1 Electronic Inks: Current and Future Materials

        3.2 Conductive Inks and Pastes for PE V3.0

        3.3 Semiconductor Inks for PE V3.0

        3.4 Some Thoughts on Printed Carbon Nanotubes and Graphene in the Future of Printed
         Electronics
        3.5 Substrate and Encapsulants for PE V3.0 Applications

        3.6 Eight-Year Forecasts of PE 3.0 Inks

For more information visit http://www.researchandmarkets.com/research/r9tl3m/printed

        Research and Markets
        Laura Wood, Senior Manager.
        press@researchandmarkets.com
        U.S. Fax: +1-646-607-1907
        Fax (outside U.S.): +353-1-481-1716
        Sector: Semiconductor
         [http://www.researchandmarkets.com/categories.asp?cat_id=102&campaign_id=r9tl3m ]


    Photo: 

http://photos.prnewswire.com/prnh/20130307/600769

SOURCE Research and Markets


Source: PR Newswire