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Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm

February 5, 2014

DUBLIN, February 5, 2014 /PRNewswire/ –

Research and Markets (
http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems) has announced the
addition of the “Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope
STMicroelectronics 3x3mm”
[http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems ] report to their
offering.

(Logo:
http://photos.prnewswire.com/prnh/20130307/600769 )

STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4,
4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus
achieving a 45% footprint reduction.

The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale
Packaging) allowing a package efficiency of 75% (silicon area/package area). This
packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the
production cost of their latest gyro.

This report provides a complete teardown of the MEMS gyro with:

        - Detailed photos
        - Material analysis
        - Comparison with iPhone 4/4S/5 gyro
        - Schematic assembly description
        - Manufacturing Process Flow
        - In-depth manufacturing cost analysis
        - Supply chain evaluation
        - Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

STMicroelectronics Company Profile

Physical Analysis

        - Physical Analysis Methodology
        - Package
        - Package Characteristics & Markings
        - Package Opening
        - Wire bonding process
        - Package Cross-Section
        - ASIC
        - ASIC Dimensions & Markings
        - ASIC Delayering
        - ASIC Cross-Section
        - ASIC Process Characteristics
        - MEMS
        - MEMS Dimensions & Markings
        - MEMS bonding pads
        - MEMS Cap Opening
        - MEMS Cap
        - MEMS Sensing Area
        - MEMS Cross-section

Comparison with iPhone 4/4S/5 Gyroscope

Manufacturing Process Flow

        - ASIC Process Flow
        - Description of the ASIC Wafer Fabrication Unit
        - MEMS Sensor Process Flow
        - MEMS Cap Process Flow
        - MEMS Wafer Bonding Process Flow
        - Description of the MEMS Wafer Fabrication Unit
        - Packaging Process Flow

Cost Analysis

        - Main Steps of Economic Analysis
        - Yields Hypotheses
        - ASIC Front-End Cost
        - ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
        - ASIC Die Cost
        - MEMS Front-End Cost
        - MEMS Front-End Cost per Process Steps
        - MEMS Front-End : Equipment Cost per Family
        - MEMS Front-End : Material Cost per Family
        - MEMS Back-End 0 : Probe Test & Dicing
        - MEMS Die Cost (Front End + Back End 0)
        - Back-End : Packaging Cost
        - Back-End : Final test & Calibration Cost
        - Component Cost (FE + BE 0 + BE 1)
        - Comparison with iPhone 4/4S/5 Gyro Component Cost

Estimated Price Analysis

For more information visit

http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net


    Photo: 

http://photos.prnewswire.com/prnh/20130307/600769

SOURCE Research and Markets


Source: PR Newswire



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