Quantcast

Reverse Costing Analysis for the Bosch Sensortec BMG160 3-Axis MEMS Gyroscope

February 5, 2014

DUBLIN, February 5, 2014 /PRNewswire/ –

Research and Markets (
http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec) has announced the
addition of the “Reverse Costing Analysis for the Bosch Sensortec BMG160 3-Axis MEMS
Gyroscope” [http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec ] report to
their offering.

(Logo:
http://photos.prnewswire.com/prnh/20130307/600769 )

The first MEMS gyroscope of Bosch for Consumer Applications Employing a New Wafer
Bonding Process

More than 10 years after the release of its MEMS gyroscopes for automotive, Bosch
Sensortec release its first 3-Axis gyroscope for consumer applications. In a market
largely dominated by STMicroelectronics and InvenSense, Bosch Sensortec was the first to
release a 3-axis MEMS gyroscope in a 3x3mmsquared package in order to gain market shares.
Although the manufacturing process (Epi-poly surface micromachining) is similar to the one
of automotive gyro, new processes for the capping and the wafer bonding has been adopted.
Indeed, the classic “glass-frit” wafer bonding has been abandoned in favor of an eutectic
bonding.

This report provides a complete teardown of the MEMS gyro with:

        - Detailed photos
        - Material analysis
        - Schematic assembly description
        - Manufacturing Process Flow
        - In-depth manufacturing cost analysis
        - Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

Bosch Company Profile

Physical Analysis

        - Physical Analysis Methodology
        - Package
        - Package Characteristics & Markings
        - Package Opening
        - Wire bonding process
        - Package CrossSection
        - ASIC
        - ASIC Dimensions & Markings
        - ASIC Delayering
        - ASIC CrossSection
        - ASIC Process Characteristics
        - MEMS
        - MEMS Dimensions & Markings
        - MEMS bonding pads
        - MEMS Cap Opening
        - MEMS Cap
        - MEMS Sensing Area
        - MEMS Crosssection

Manufacturing Process Flow

        - ASIC Process Flow
        - Description of the ASIC Wafer Fabrication Unit
        - MEMS Sensor Process Flow
        - MEMS Cap Process Flow
        - MEMS Wafer Bonding Process Flow
        - Description of the MEMS Wafer Fabrication Unit
        - Packaging Process Flow

Cost Analysis

        - Main Steps of Economic Analysis
        - Yields Hypotheses
        - ASIC FrontEnd Cost
        - ASIC BackEnd 0 : Probe Test, Thinning & Dicing
        - ASIC Die Cost
        - MEMS FrontEnd Cost
        - MEMS FrontEnd Cost per Process Steps
        - MEMS FrontEnd : Equipment Cost per Family
        - MEMS FrontEnd : Material Cost per Family
        - MEMS BackEnd 0 : Probe Test & Dicing
        - MEMS Die Cost (Front End + Back End 0)
        - BackEnd : Packaging Cost
        - BackEnd : Final test & Calibration Cost
        - Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

For more information visit

http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net


    Photo: 

http://photos.prnewswire.com/prnh/20130307/600769

SOURCE Research and Markets


Source: PR Newswire



comments powered by Disqus