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Taiwan and China Semiconductor Industries Development Review and Forecasts in New Research Report

April 2, 2014

Sandlerresearch.org adds Review on the Development of Cross-Strait Semiconductor Industries in 2013 research report to its store.

DALLAS, April 2, 2014 /PRNewswire-iReach/ — Driven by the Chinese government’s preferential policies and enormous domestic market needs, international semiconductor vendors have constantly set up plants in China to strengthen their deployment. The movement has also contributed to the development of Chinese IC design houses, manufacturers, and packaging and testing vendors. As a result, the Chinese semiconductor industry has seen stunning growth since 2010, posing serious threats to the development of the Taiwanese semiconductor industry. This report “Review on the Development of Cross-Strait Semiconductor Industries in 2013 – http://www.sandlerresearch.org/review-on-the-development-of-cross-strait-semiconductor-industries-in-2013.html” will analyze the current status of Taiwanese and Chinese semiconductor industries as well as the existing and future development of the sub-industries in Taiwan and China.

(Photo: http://photos.prnewswire.com/prnh/20140402/MN96368)

List of Topics

Sector-by-sector comparison between Chinese and Taiwanese semiconductor industries, including shipment value reviews and forecasts, the ranking of top ten vendors, and major vendors’ latest development in each sector

Companies and organizations analyzed or mentioned in the report include:

Allwinner Technology, APS, ASE, ASE Assembly & Test, ASEN Semiconductors, Casio Micronics, CEC Huada Electronic Design, Cension Semiconductor Manufacturing, China Integrated Circuit Design Center, China Resources Microelectronics, Chipbond, ChipMOS, Elpida, FATC, Freescale Semiconductor, Fujitsu, Galaxycore, Global Unichip, Globalfoundries, Grace Semiconductor Manufacturing, Greatek Electronic, HHGrace, Himax, Hisilicon, Hitech Semiconductor, HJTC, Hua Hong NEC, Huawei, Ilitek, Infineon, Inotera Memories, Intel, Jiangsu Changjiang Electronics Technology, Jilin Sino-Microelectronics, KYEC, Leadcore Technology, Lingsen Precision Industries, Macronix, MediaTek, Micron, Microsoft, MStar, Nantong Fujitsu Microelectronics, Nantong Huada Microelectronics, Nanya Technology, Novatek, Nufrontsoft, Nuvoton Technology, Orisetech, OSE, Phison Electronics, Powerchip, Powertech Technology, Qualcomm, Raydium Semiconductor, RDA Microelectronics, Realtek, Renesas Electronics, Rexchip, RF Micro Devices, Richtek Technology, Rockchip, Samsung, Shanghai Matsushita Semiconductor, Shanghai Huahong Grace Semiconductor Manufacturing, Shanghai HuaLi Microelectronics, Shanghai Kai Hong Electronic, Shenzhen High Tech Industrial Company, Silan, SK Hynix, SMIC, SMIT, SPIL, Spreadtrum, ST, Taiji Industry, Teramikros, Texas Instruments, Toshiba, Tsinghua Unisplendour, TSMC, UMC, Vimicro, VIS, WAE, Walton Advanced Engineering, Winbond, Wuxi Tongzhi Microelectronics, Yang Ding Tech, Zhonghuan Semiconductor

Current and future development of Chinese and Taiwanese semiconductor industry, comprising of IC design, memory and wafer manufacturing, and IC packaging and testing sectors

Order a copy of report @ http://www.sandlerresearch.org/purchase?rname=16043.

Table of Contents

1.Comparison of Cross-Strait Semiconductor Industry’s Production Value and Structure

2.Comparison of Cross-Strait IC Design Industries

2.1 Comparison of Industry Value

2.2 Development of Top Ten IC Design Houses in China and Taiwan

2.2.1 Smart Handheld Device Core IC Vendors

2.2.2 Panel Driver IC Vendors

2.2.3 Vendors in Other Industries

3.Comparison of Cross-Strait IC Manufacturing Industries

3.1 Comparison of Industry Value

3.2 Chinese IC Manufacturing Industry Clusters

3.3 Development of Top Ten IC Manufacturers in China and Taiwan

3.4 Comparison of Process Technologies and Production Capacity

4.Comparison of Cross-Strait IC Packaging and Testing Industries

4.1 Comparison of Industry Value

4.2 Chinese IC Packaging and Testing Industry Clusters

4.3 Development of Top Ten IC Packaging and Testing Vendors in China and Taiwan

4.3.1 Development of Taiwanese IC Packaging and Testing Vendors

4.3.2 Development of Chinese IC Packaging and Testing Vendors

MIC Perspectives

Competition of IC Design for Smart Handheld Devices Intensifies

Increased Competition in 28nm Process Technology with Steady 8-inch Wafer Demand

Appendix

Glossary of Terms

List of Companies

List of Tables

Table 1 Top Ten Chinese and Taiwanese IC Design Houses, 2012

Table 2 Top Ten Chinese and Taiwanese IC Manufacturers, 2012

Table 3 Top Ten Taiwanese IC Packaging and Testing Vendors, 2012 – 2013

Table 4 Top Ten Chinese IC Packaging and Testing Vendors, 2011 – 2012

List of Figures

Figure 1 Chinese and Taiwanese Semiconductor Industry Value, 2009 – 2015

Figure 2 Revenue Share of Chinese and Taiwanese Semiconductor Industries by Sector, 2008 – 2013

Figure 3 Chinese and Taiwanese IC Design Industry Value, 2004 – 2013

Figure 4 Chinese and Taiwanese IC Manufacturing Industry Value, 2006 – 2013

Figure 5 Chinese IC Manufacturing Industry Clusters

Figure 6 Process Technologies Adopted by Taiwanese, Chinese, and Foreign IC Manufacturers, 1Q 2012 – 4Q 2013

Figure 7 Production Capacity of Chinese and Taiwanese IC Manufacturing Industries, 2012 – 2016

Figure 8 Chinese and Taiwanese IC Packaging and Testing Industry Value, 2006 – 2013

Figure 9 Chinese IC Packaging and Testing Industry Clust

Other Reports on Semiconductor & Electronics Market

Taiwanese Semiconductor Manufacturing Industry, 1Q 2014: The research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry. Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including IC foundries, DRAM (Dynamic Random Access Memory) vendors, and IDM (Integrated Device Manufacture) companies. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese semiconductor manufacturing industry dropped 4.0% sequentially to reach around US$8.5 billion in the fourth quarter of 2013. The decline is expected to continue well into the first quarter of 2014, with the industry’s shipment value sliding 7.4% sequentially to around US$7.9 billion.

The Worldwide and Taiwanese Semiconductor Industry, 2013 Recap and 2014 Forecast:

List of Topics Covered

    --  Current and future development of worldwide and Taiwanese semiconductor
        industry, comprising of mainly wafer foundries, IDMs (Integrated Device
        Manufacturers), IC design, memory, and IC packaging and testing sectors
    --  Development of major companies in the global semiconductor industry,
        including semiconductor market value forecast for the period 2014 - 2015
    --  Development of the Taiwanese semiconductor industry, with shipment value
        breakdown by sector

Companies and organizations analyzed or mentioned in the report include:

Allwinner Technology, Altera, Apple, Elpida, GlobalFoundries, Hynix, IBM, Ingenic, Inotera Memories, LeadCore, MediaTekl, Micro, RDA, Microelectronics, Rexchip, RockChip, Samsung, Spreadtrum, TSMC, UMC

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Sandlerresearch.org (http://www.sandlerresearch.org/) is an online market research store for research reports on multiple industries. These reports provide market analysis, trends and opportunities and forecast about industries that helps to make a right decision for the business. Call +1 888 391 5441+1 888 391 5441 with your research requirements or email the details at sales@sandlerresearch.org.

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