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Thin Film Deposition: Trends, Key Issues, Market Analysis

April 11, 2014

DUBLIN, April 11, 2014 /PRNewswire/ –

Research and Markets (http://www.researchandmarkets.com/research/6njz3z/thin_film)
has announced the addition of the “Thin Film Deposition: Trends, Key Issues, Market
Analysis.” [http://www.researchandmarkets.com/research/6njz3z/thin_film ] report to their
offering.

(Logo:
http://photos.prnewswire.com/prnh/20130307/600769 )

Thin film deposition processes play a critical role in the production of high-density,
high-performance microelectronic products. Considerable progress has been achieved in the
development of deposition processes — and in the development of the reactor systems
[http://www.researchandmarkets.com/research/6njz3z/thin_film ] in which they are carried
out.

This report discusses the technology trends, products, applications, and suppliers of
materials and equipment.

It also gives insights to suppliers for future user needs and should assist them in
long range planning, new product development and product improvement.

This report compares some of the issues impacting users of different deposition tools,
including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD.

        Key Topics Covered:

        Chapter 1: Introduction

        Chapter 2: Executive Summary

        Chapter 3: Physical Vapor Deposition
        3.1 Introduction
        3.2 Sputtering Technology
        3.3 Plasma Technology
        3.4 Reactor Designs
        3.5 Semiconductor Processing
        3.6 Targets

        Chapter 4: Chemical Vapor Deposition
        4.1 Introduction
        4.2 Chemical Vapor Deposition (CVD) Techniques

        Chapter 5: Electrochemical Deposition
        5.1 Introduction
        5.2 Reactor Design
        5.3 Challenges
        5.4 Additives
        5.5 Processing
        5.6 Copper Cathodes

        Chapter 6: Film Deposition And Film Properties
        6.1 Introduction
        6.2 Dielectric Deposition
        6.3 Metal Deposition

        Chapter 7: Vendor Issues
        7.1 Introduction
        7.2 300mm Processing
        7.3 Integrated Processing
        7.4 Copper
        7.5 Metrology
        7.6 ESD
        7.7 Parametric Test

        Chapter 8: Market Forecast
        8.1 Introduction
        8.2 Key Issues
        8.3 Market Forecast Assumptions
        8.4 Market Forecast
        8.4.1 Chemical Vapor Deposition
        8.4.2 Physical Vapor Deposition
        8.4.3 Copper Electroplating Market
        8.4.4 Atomic Layer Deposition Market

For more information visit

http://www.researchandmarkets.com/research/6njz3z/thin_film

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net


    Photo: 

http://photos.prnewswire.com/prnh/20130307/600769

SOURCE Research and Markets


Source: PR Newswire



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