Tengion to Present at the 14th Annual BIO CEO & Investor Conference
WINSTON-SALEM, N.C., Feb. 7, 2012 /PRNewswire/ — Tengion, Inc. (NASDAQ: TNGN), a leader in regenerative medicine, today announced that Brian Davis, Chief Financial Officer and Vice President, Finance of Tengion, will present at the upcoming 14th Annual BIO CEO & Investor Conference on Tuesday, February 14, 2012, at 11:30 a.m. EST in New York City.
A live audio webcast of the presentation can be accessed at http://www.veracast.com/webcasts/bio/ceoinvestor2012/61208214.cfm or under “Calendar of Events” in the Investors section of the Company’s website at www.tengion.com. A replay of the presentation will be available on Tengion’s website for 90 days. Investors interested in listening to the live webcast should log on before the start time in order to download any software required.
Tengion, a clinical-stage biotechnology company, has pioneered the Organ Regeneration Platform(TM) that enables the Company to create proprietary product candidates that are intended to harness the intrinsic regenerative pathways of the body to produce a range of native-like organs and tissues. Tengion’s product candidates seek to eliminate the need to utilize other tissues of the body for a purpose to which they are poorly suited, procure donor organs or administer anti-rejection medications. An initial clinical trial is ongoing for the Company’s lead product candidate, the Neo-Urinary Conduit(TM), an autologous implant that is intended to catalyze regeneration of native-like bladder tissue for bladder cancer patients requiring a urinary diversion following bladder removal. The Company’s lead preclinical candidate is the Neo-Kidney Augment(TM), which is designed to delay or prevent the need for dialysis or transplantation in patients at risk for kidney failure. Tengion has also applied its technology in two Phase II clinical trials for Tengion’s Neo-Bladder Augment(TM) for the treatment of neurogenic bladder. Tengion has worldwide rights to its product candidates.
SOURCE Tengion, Inc.