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Last updated on April 19, 2014 at 21:20 EDT

Microsemi’s New Packaging Technology Enables Miniaturized Implantable Medical Devices

August 21, 2012

ALISO VIEJO, Calif., Aug. 21, 2012 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new die packaging technology has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards. The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators. It can also be used in wearable devices such hearing aids and intelligent patches, as well as nerve stimulators and drug delivery products.

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Microsemi’s breakthrough packaging technology delivers a footprint reduction of approximately 75 percent over the company’s currently available implantable radio modules. Device miniaturization allows physicians to use less invasive procedures, enabling faster recovery times and improvements in patient comfort while concurrently lowering health care costs. Smaller, lighter weight wireless medical devices also afford patients greater mobility.

“This internal die packaging technology qualification aligns with our customers’ required parameters, providing a solution to drive the development of miniaturized wireless medical products,” said Martin McHugh, business and technology development manager of advanced packaging for Microsemi. “Our advanced packaging technology can also be paired with our industry-leading, ultra low-power ZL70102 radio to enable wireless healthcare monitoring. Moving forward, we plan to apply our size-reduction techniques and radio technologies to other markets such as smart sensing and applications where size and weight are critical success factors.”

About the ZL70102
Microsemi’s ultra low-power ZL70102 transceiver chip supports a very high data rate RF link for medical implantable communication applications. The chip’s unique design allows patient health and device performance data to be quickly transmitted with little impact to the useful battery life of the implanted device. The ZL70102 is designed for use in both implanted medical devices and base stations, and operates in the 402-405 MHz MICS band. Multiple low power wake-up options are supported including using 2.45 GHz ISM band wake-up receive option for ultra low-power operation receiver option.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

“Safe Harbor” Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new die packaging technology for active implantable medical devices and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company’s products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company’s most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi’s future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

SOURCE Microsemi Corporation


Source: PR Newswire