High-Performance Liquid Dispensed Thermal Interface Material Bergquist Gap Filler 1000SR
Gap Filler 1000SR is a new two-part Gap Filling Thermal Interface Material that dispenses precisely without slumping offering the ideal form-in-place thermal solution.
Chanhassen, MN (PRWEB) June 22, 2012
The Bergquist Company is proud to introduce Gap Filler 1000SR (Two-Part), the latest member of its industry-leading Gap Filler family. Gap Filler 1000SR is a two-component, room temperature cure, liquid-dispensable thermal interface material that features superior slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for ultimate flexibility in component orientation during assembly. Gap Filler 1000SR is thixotropic and although it will remain in place after dispensing, the material will flow easily under minimal pressure resulting in little to no stress on fragile components during assembly. As cured, this soft elastomer provides a thermal conductivity of 1.0 W/mK that is ideal for filling unique and intricate air voids and gaps.
Unlike precured gap filling materials, the liquid approach offers infinite thickness options and eliminates the need for specific pad thicknesses or die-cut shapes for individual applications. Gap Filler 1000SR is specifically designed with shear thinning characteristics to support optimized dispensing. Applying precise amounts of material directly to the target surface results in effective use of material with minimal waste. Available in cartridge and kit form, this material is well suited for manual or automated dispensing.
The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating Gap Fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.
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