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NexLogic Technologies to Present Up-to-Date PoP Technology Conference Paper at PCBWest 2012 in Santa Clara CA

September 7, 2012

Join NexLogic Technologies, Inc. at PCBWest 2012 Technical Conference on September 25-26 at the Santa Clara Convention Center. NexLogic´s president Zulki Khan will present on the latest Package on Package (PoP) Technology.

(PRWEB) September 06, 2012

NexLogic Technologies, Inc., a complete one-stop shop for PCB design, fabrication, assembly, and test today announced it will participate at the PCBWest 2012 Technical Conference scheduled for September 25-26 at the Santa Clara Convention Center.

Topic of NexLogic´s hour-long conference paper and presentation is a tutorial on package on package (PoP)-based PCB design and assembly. The presentation/Session A4 is scheduled for Wednesday, September 26 at 1:30 pm.

NexLogic´s President, Zulki Khan, said, “Today, package on package technology is making greater inroads into new products based on both large and small printed circuit boards (PCBs). OEMs are well into two-layer, processor and memory chip, PoP at the 0.5mm pitch BGA levels. But there´s a definite game changer going into 0.4mm pitch and beyond BGA PoP technology. And that´s where we´ll focus our discussion on cutting edge PoP design and assembly technologies at PCBWest 2012.”

Included in the hour-long presentation, Mr. Khan and his design staff, will place emphasis on design factors affecting PoP-populated PCBs. Those include pad design, via in pad guidelines, via definitions, and fan out requirements. In particular, concentrated discussion will be on pad design considerations at 0.4mm ultra-fine pitch PoP-BGAs and lower.

NexLogic´s PoP coverage will also include knowing PCB fabricator´s limits and details the top three categories of board fabricating capabilities. The third portion of the discussion goes toward PoP-populated PCB assembly challenges, what the OEM can expect, and the best ways to overcome those challenges with assembly floor trained personnel and creative measures using today´s assembly equipment.

For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2012/9/prweb9868667.htm


Source: prweb



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