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Carsem hosts the 35th IEEE CPMT International Electronics Manufacturing Technology Conference (IEMT 2012)

October 5, 2012

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, are pleased to announce they will be hosting the 35th IEEE CPMT International Electronics Manufacturing Technology Conference (IEMT 2012) which will be held on the 6th — 8th November, 2012 at the Kinta Riverfront Hotel, Ipoh, Perak, Malaysia

Malaysia (PRWEB) October 05, 2012

International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Components Packaging and Manufacturing Technology (CPMT) Society of IEEE. IEMT 2012 is being organized by the IEEE CPMT Malaysia Chapter with co-sponsorship from CPMT’s Santa Clara Valley Chapter.

IEMT 2012 will feature short courses, technical sessions, and exhibitions. It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation. IEMT 2012 is an international forum, providing opportunities to network and meet leading experts. Since the 1980′s and 1990′s, IEMT has gained a reputation as a premier electronics materials and packaging conference and is well attended by experts in the field of electronic packaging from all over the world.

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For Conference Registration form and course fee Click here

About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem´s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.

For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2012/10/prweb9973311.htm


Source: prweb