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BCC Research Expects the Global Market for Engineering Resins and Polymer Alloys and Blends to Reach 28 Billion Pounds by 2018.

May 19, 2013

The global market in volume for engineering resins and polymer alloys and blends was estimated at more than 22 billion pounds in 2012 and is projected to increase to 28 billion pounds by 2018 after increasing at a five-year compound annual growth rate (CAGR) of 4.4%. Asia comprises the largest segment with nearly 55% of the total market, followed by Europe and the Americas; over the next five years, the Asian segment will increase, but at a slower rate than the previous decade due to significant penetration over the last decade.

Wellesley, MA (PRWEB) May 19, 2013

The global market in volume for engineering resins and polymer alloys and blends was estimated at more than 22 billion pounds in 2012 and is projected to increase to 28 billion pounds by 2018 after increasing at a five-year compound annual growth rate (CAGR) of 4.4%.

Asia comprises the largest segment with nearly 55% of the total market, followed by Europe and the Americas. Over the next five years, the Asian segment will increase, but at a slower rate than the previous decade due to significant penetration over the last decade. The global market value was estimated at nearly $43 billion in 2012 and is expected to increase to more than $55 billion by 2018.

The polycarbonates and polyamides are clearly the most prominent segments, accounting for slightly more than 60% of total volume, and that scenario is expected to remain intact over the next five years. The main driving force for developing alloys/blends is the reduced time and cost in commercializing new effective products, and ability to tailor properties with two known entities.

In terms of technology-driven factors, miniaturization of electronic/electric products is still a very important factor, although it may begin to reach its saturation point; thin-walling of molded parts; and higher soldering temperatures due to SMT and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics used to mold electronic components. Technology factors will drive the use for resins with higher HDTs and Tgs and lower dielectric constants. Resins with higher physical profiles will be in greater demand to meet these requirements, but pricing still remains an important consideration.

Demand for medical plastics will outpace packaging applications, especially in the area of prosthetic devices and minimally-invasive surgical instruments. Plastics in the packaging sector are largely driven by cost. Most consider that the use of engineering resins will increase faster than commodity resins because of increased physical demands being placed on resins used for medical devices.

Presterilized disposable plastic medical devices are generally replacing reusable devices, both plastic and nonplastic. The single largest driving force has been fear of spreading communicable diseases in the healthcare environment; the trend is supported by the cost-effectiveness of disposables versus reusables.

The objective of Engineering Resins, Polymer Alloys and Blends (PLS020C) is to provide a detailed analysis of engineering resins along with polymer alloys/blends. Usage of these resins will be segmented into a wide variety of applications and analyses, and will include some intracompetition of these resins among themselves along with selected commodity thermoplastics and thermosets.

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Source: prweb



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