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Lucintel Analyzes EMC in Global Semiconductor Packaging Industry: Market Expected to Reach $1,702 Million in 2017

May 30, 2013

Lucintel Analyzes EMC in Global Semiconductor Packaging Industry: Market Expected to Reach $1,702 Million in 2017

Irving, TX (PRWEB) May 30, 2013

The epoxy molding compound (EMC) market in the semiconductor packaging industry has witnessed growth over the last five years. It is expected to continue its growth momentum and reach approximately US $1,702 million by 2017. Numerous factors influence the EMC market in the semiconductor packaging industry.

Lucintel, a leading global management consulting and market research firm, has analyzed the EMC in global semiconductor packaging industry and presents its findings in “Opportunities of EMC in Global Semiconductor Packaging Industry: 2012-2017 Trends, Forecast, and Opportunity Analysis.”

Lucintel´s research indicates that the industry has displayed cyclical behavior: During the upturn years, the generated profits are used to sustain operations during economic downturns. During upturn periods, however, investment is greater than demand, due to which growth is slow for a longer period during the downturn and the poor performers struggle. The companies holding greater market share are creating higher profits because they have closer relationships with key customers and possess better research and development processes that yield better innovations and a greater ability to maintain profit during downturns.

The composition for epoxy molding compound for encapsulation of semiconductors are epoxy resins, fused silica, coupling agent, hardener, flame retardants, curing promoters, release agent, and low stress additives. Previously, bisphenol-A was used as the epoxy resin; epoxy cresol novolac is now preferred over bisphenol-A because of better resistance to heat. Epoxy resin is preferred to produce EMC due to its unique attributes. In EMCs, the filler represents up to 75% by weight. Fillers provide mechanical strength to the EMC and reduce the thermal expansion coefficient, which reduces the shrinkage after molding.

The market research report provides an overview of trend scenarios and forecast statistics for 2012-2017; presents industry drivers and challenges; and opportunities for suppliers worldwide. This report will benefit manufacturers, material suppliers and the end user market.

For a detailed table of contents and pricing information on this timely, insightful report, contact Lucintel at +1-972-636-5056 or via email at helpdesk(at)lucintel(dot)com. Lucintel provides cutting-edge decision support services that facilitate critical decisions with greater speed, market insight, and cost efficiency.

Lucintel now offers free Live Chat on its website to answer visitors´ questions in real time with precision. Visitors can directly chat with our experts through Live Chat to receive assistance and information regarding Lucintel´s product and service offerings.

For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2013/5/prweb10783516.htm


Source: prweb