Master Bond’s Supreme 3HTND-2GT, A New Thermally Conductive, Electrically Insulative One Part Epoxy for Bonding, Sealing and Glob Top Applications
Supreme 3HTND-2GT is a new, one component, high performance epoxy system that features fast curing and is ideal for glob top applications as well as bonding and sealing. It is formulated to withstand thermal cycling and shock.
(PRWEB) October 22, 2013
Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.
As a one component system, Supreme 3HTND-2GT does not require mixing and features a thicker viscosity with limited flow characteristics. Unlike many epoxies it can be readily and efficiently applied to a defined area. It cures quickly in 20-30 minutes at 250°F or in 5-10 minutes at 300°F with very low shrinkage. Supreme 3HTND-2GT can cure in thicknesses of up to 1/8 inch if needed.
Additionally, this dimensionally stable system is capable of withstanding rigorous thermal cycling and shocks. Thermally stable, the service temperature range for this system is first rate at -100°F to +400°F. It resists chemicals rather well, including water, acids, bases and many solvents. Particularly noteworthy is its low level of ionic impurities.
Supreme 3HTND-2GT is yellowish tan in color and is available in a variety of packaging including syringes, cartridges, pints, quarts and gallon containers.
Master Bond Toughened Epoxy Compounds
Master Bond Supreme 3HTND-2GT is a multifunctional system for glob top, die attach, bonding and sealing applications featuring thermal conductivity, high temperature resistance and toughness. Read more at http://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132.
For the original version on PRWeb visit: http://www.prweb.com/releases/2013/10/prweb11256522.htm