Quantcast

Global Semiconductor Capital Equipment Market 2012-2016

October 30, 2013

Reportbuyer.com just published a new market research report: Global Semiconductor Capital Equipment Market 2012-2016.

London (PRWEB) October 30, 2013

TechNavio's analysts forecast the Global Semiconductor Capital Equipment market to grow at a CAGR of 3 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing demand for semiconductor capital equipment in smartphones. The Global Semiconductor Capital Equipment market has also been witnessing an increased number of mergers and acquisitions. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market.

TechNavio's report, the Global Semiconductor Capital Equipment Market 2012-2016, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market in the Americas, and the EMEA and APAC regions; it also covers the Global Semiconductor Capital Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.

The key vendors dominating this space include Applied Materials Inc., ASML Holdings N.V., Tokyo Electron Ltd., and Lam Research Corp.

The other vendors mentioned in the report are Advantest Corp., ASM International N.V., Dainippon Screen Mfg. Co., Hitachi High- Technologies Corp., KLA-Tencor Corp., and Nikon Instruments Inc.

Key questions answered in this report:

What will the market size be in 2016 and what will be the growth rate?

What are key market trends?

What is driving this market?

What are the challenges to market growth?

Who are the key vendors in this market space?

What are the market opportunities and threats faced by key vendors?

What are the strengths and weaknesses of each of these key vendors?

You can request one free hour of our analyst’s time when you purchase this market report. Details provided within the report.

Methodology

Research methodology is based on extensive primary and secondary research. Primary research includes in-depth interviews with industry experts, vendors, resellers and customers. Secondary research includes Technavio Platform, industry publications, company reports, news articles, analyst reports, trade associations and the data published by Government agencies.

01. Executive Summary

02. List of Abbreviations

03. Introduction

04. Market Research Methodology

Market Research Process

Research Design

Research Methodology

05. Scope of the Report

Market Overview

Product Offerings

06. Market Landscape

06.1 Market Size and Forecast

07. End-user Segmentation

07.1 Wafer Fab Equipment

Market Size and Forecast

07.2 Wafer-Level Packaging and Assembly

Market Size and Forecast

07.4 Die-Level Packaging and Assembly

Market Size and Forecast

06.5 Automated Test Equipment

Market Size and Forecast

07.3 Five Forces Analysis

08. Geographical Segmentation

09. Vendor Landscape

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Key Vendor Analysis

16.1 Applied Materials, Inc.

Business Overview

Business Segmentation

SWOT Analysis

16.2 ASML Holdings N.V.

Business Overview

SWOT Analysis

16.3 Tokyo Electron Ltd.

Business Overview

Business Segmentation

SWOT Analysis

16.4 Lam Research Corp.

Business Overview

SWOT Analysis

17. Other Reports in this Series

List of Exhibits

Exhibit 1: Market Research Methodology

Exhibit 2: Global Semiconductor Capital Equipment Market 2012-2016 (US$ billion)

Exhibit 3: Global Semiconductor Capital Equipment Market by Type of Equipment 2012

Exhibit 4: Global Semiconductor Capital Equipment Market by Type of Equipment 2012-2016

Exhibit 5: Global Wafer Fab Equipment Market 2012-2016 (US$ billion)

Exhibit 6: Global Wafer-Level Packaging and Assembly Market 2012-2016 (US$ billion)

Exhibit 7: Global Die-Level Packaging and Assembly Market 2012-2016 (US$ billion)

Exhibit 8: Global Automated Test Equipment Market 2012-2016 (US$ billion)

Exhibit 9: Global Semiconductor Capital Equipment Market by Geographical Segmentation 2012

Exhibit 10: Semiconductor Capital Equipment Market in APAC Region 2012-2016 (US$ billion)

Exhibit 11: Semiconductor Capital Equipment Market in Americas 2012-2016 (US$ billion)

Exhibit 12: Semiconductor Capital Equipment Market in EMEA Region 2012-2016 (US$ billion)

Exhibit 13: Semiconductor Capital Equipment Market in Korea 2012-2016 (US$ billion)

Exhibit 14: Semiconductor Capital Equipment Market in Taiwan 2012-2016 (US$ billion)

Exhibit 15: Semiconductor Capital Equipment Market in the US 2012-2016 (US$ billion)

Exhibit 16: Global Semiconductor Capital Equipment Market by Vendor Segmentation 2012

Exhibit 17: Global Semiconductor capital Equipment Market by Vendor Segmentation 2011

Exhibit 18: Global Smartphones Market by Unit Shipment 2012-2016 (million units)

Exhibit 19: Global Tablet Computer Market by Unit Shipments 2012-2016 (million units)

Exhibit 20: Business Segmentation of Applied Materials, Inc.

Exhibit 21: Business Segmentation of Tokyo Electron Ltd.

Companies Mentioned

Applied Materials Inc., ASML Holdings N.V., Tokyo Electron Ltd., Lam Research Corp., Advantest Corp., ASM International N.V., Dainippon Screen Mfg. Co., Hitachi High- Technologies Corp., KLA-Tencor Corp., and Nikon Instruments Inc.

Read the full report:

Global Semiconductor Capital Equipment Market 2012-2016

http://www.reportbuyer.com/computing_electronics/semiconductors/global_semiconductor_capital_equipment_market.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

For more information:

Sarah Smith

Research Advisor at Reportbuyer.com

Email: query@reportbuyer.com

Tel: +44 208 816 85 48

Website: http://www.reportbuyer.com

For the original version on PRWeb visit: http://www.prweb.com/releases/2013/11/prweb11284899.htm


Source: prweb



comments powered by Disqus