Applied Materials Announces Breakthrough in Interface Engineering Technology for 65-45nm Transistors
Posted on: Tuesday, 20 September 2005, 09:00 CDT
Applied Materials, Inc. today announced a key advancement in nano-scale interface engineering with its new Applied Siconi(TM) Preclean process for fabricating leading-edge transistor contacts. The Siconi Preclean replaces conventional plasma-based sputter etch technology with a dry, chemical process that gently but effectively removes oxidized silicon under high vacuum. This one-step process prepares the wafer's surface prior to the formation of the critical nickel (Ni) silicide layer to create an interface with minimal damage. The Siconi Preclean also dramatically reduces interface defects while eliminating wet clean queue time restrictions.
"The smallest transistor structures are now only a few atoms or molecules in size, making atomic-level thin film interface engineering extremely critical to the chip's function," said Dr. Farhad Moghadam, senior vice president and general manager of Applied Materials' Thin Films Group. "Combined with our Applied Endura ALPS(R) Ni PVD(1) system, this new Siconi Preclean process enables advanced logic customers to more easily transition to nickel silicide technology to achieve higher switching speeds with lower current leakage -- thus helping to reduce power usage in their advanced chip designs. We are working to extend the breakthrough advantages of our Siconi Preclean technology to other process applications."
The Applied Siconi Preclean process, which is completed in a single chamber for optimal throughput and system utilization, is highly selective to oxide, enabling oxide removal with minimal impact to other materials or small features on the device. The Siconi Preclean technology can also be used after silicidation to remove the oxidized silicide, forming a low resistance interface with the contact structure. For more information on the Applied Siconi Preclean, please visit: http://www.appliedmaterials.com/products/alps_ni_pvd.html?menuID=1_12_ 5 (Due to its length, this URL may need to be copied/pasted into your Internet browser's address field. Remove the extra space if one exists.).
Multiple Applied Materials systems with the Siconi Preclean chamber have been shipped to 5 of the top 10 chipmakers in the US, Japan and Asia; customers have also placed orders to add this innovative Siconi Preclean technology to their installed base of systems.
Applied Materials, Inc. (Nasdaq:AMAT), headquartered in Santa Clara, California, is the largest supplier of equipment and services to the global semiconductor industry. Applied Materials' web site is www.appliedmaterials.com. (1) PVD: physical vapor deposition
Source: Business Wire
Related Articles
- EV Group to Collaborate with Applied Materials On Thin Wafer Bonding Technology for 3D IC Development
- Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips With Extensa PVD System
- Applied Materials Opens SunFab Technology Center to Accelerate Solar Innovation
- Applied Materials Selected By Moser Baer to Deliver World's First Gen 8.5 Thin Film Solar Production Line
- Applied Materials Delivers Advanced Metal Hardmask Technology for Patterning Ultralow K Dielectrics
- Applied Materials Launches Strategy to Reduce the Cost Per Watt of Solar Power
- Applied Materials' New High-Speed Process Monitoring Solution Boosts System Productivity and Fab Yield
- Applied Materials and IMEC Team to Develop Innovative 32nm, 22nm Interconnects
- Applied Materials Showcases Leadership in 2005 Environmental Performance Report
 |
 |
User Comments (0)
RSS Feeds