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XLoom Communications Unveils iFlame(TM), the First Multi-Channel Optical Chip, Enabling Cost-Efficient Optical Links for Grid Networking Applications

Posted on: Monday, 10 September 2007, 06:00 CDT

XLoom Communications, Inc. a developer of chip-scale optoelectronic interconnects, today introduced its iFlame™ optical chip, the first multi-channel, high-density, cost-effective, optical engine for grid computing and data center applications.

iFlame™, the industry's first chip-scale 4-channel optical transceiver, is aimed at data center applications running over InfiniBand, Ethernet and Fiber-Channel. The iFlame™ chip, implemented as an optical engine, enables high-speed, high-density, cost-effective interconnect applications such as Opto-electrical media converters, optical active connectors and cables as well as traditional transceivers such as the upcoming QSFP form factor.

The iFlame™, which is less than 1 square/CM in size, features an array of four state-of-the-art 850 nm VCSELs (Vertical-Cavity Surface-Emitting Lasers) and four photo-diodes for data rates of 1.25Gbps to 5Gbps per channel, for a total aggregate of up to 20Gbps.

Key technology highlights:

4-channel transmit and receive

Data rate: up to 5Gbp per channel

Supports both 62.5µ and 50µ industry standard MTP®/MPO multi-mode ribbon fibers

Chip size: 10mm X 5mm X 2mm

Uses 4X850nm VCSEL array

Data I/O is AC coupling, PECL, LVDS and CML compatible

According to IDC, grid computing is becoming pervasive in the enterprise data center and high speed protocols, mainly InfiniBand, are gaining market share. These protocols are trying to break out of the limitations of using bulky copper cables that are both limited in reach and hard to handle.

"We know the industry is looking for high-density, cost-efficient, multi-channel optical solutions in their data center applications," said David Sachs XLoom's CEO. "iFlame™ enables a multitude of low-cost optical products such as active optical cables, transceivers and small form factor optical interconnects. Our customers now have the opportunity to offer a variety of optical interconnects solutions by using iFlame™ as their optical engine, designing small form factor devices."

Avner Badihi, XLoom, president and co-founder, added: "iFlame™ is based on our patented wafer-level XFLame™ technology and is our second generation of commercial optical chips. Using standard semiconductor processes and allowing for a cost as low as $1 per 1Gbps in volumes, we are positioned to not only satisfy current high-speed protocols, but to also meet the needs of emerging high-speed protocols, such as the upcoming 40Gb Ethernet and InfiniBand QDR (Quad Data Rate)."

iFlame™ optical chips are currently sampling, with a follow up end-user product to be announced by XLoom Communications during the next month.

About XLoom Communications

XLoom Communications, Inc. (www.xloomcom.com), an industry innovator of chip-scale optoelectronic interconnects, delivers low-power, high-speed interconnect solutions for data center applications such as Ethernet, Infiniband and backplanes. XLoom's solutions enable the cost-effective alternative to copper interconnects in high-speed data center environments, where the physical limitations of copper are costly and ineffective. XLoom is based in Tel-Aviv, Israel and in the San Francisco Bay Area.

© Copyright 2007, XLoom Communications, Inc. All rights reserved. XLoom, the XLoom logo BlueFlame, XFLame and iFlame are trademarks of XLoom Communications, Inc. Other company, product, or service names are the property of their respective owners.

Source: Business Wire

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