Tektronix Demonstrates First and Most Comprehensive Test for Intel QuickPath Interconnect at Developer Forum
BEAVERTON, Ore., Sept. 18 /PRNewswire-FirstCall/ — Tektronix, Inc. , a leading worldwide provider of test, measurement and monitoring instrumentation, announced that it is providing a comprehensive technology demonstration of its unique test and measurement capabilities for the new Intel QuickPath interconnect and other related buses at the Intel Development Forum (IDF) in San Francisco. The Intel QuickPath architecture for servers, workstations, and high-end desktop computers delivers the additional performance, bandwidth and reliability required to support the next generation Intel processors and platforms.
The QuickPath interconnect unveiled at IDF will provide leading interconnect bandwidth to unleash the performance of Intel’s future generations of multi-core microprocessors. Along with the new QuickPath interconnect, new systems will also incorporate new PCIe Gen2 buses and the latest DDR3 technology. Concurrent visibility of these high-speed serial and parallel bus interfaces and being able to see this date time-correlated is critical in validating the performance of new systems.
In booth 740, Tektronix is demonstrating a complete solution that allows validation engineers to monitor Intel’s QuickPath interconnect as well as DDR3 and PCIe Gen2 interfaces. This demonstration shows a TLA7000 mainframe populated with the new TLA7S16 module for PCIe 1.x and 2.0, and an acquisition card tailored to capture and analyze the QuickPath interconnect and the latest DDR3 buses. This complete logic analyzer solution gives quick insight into all aspects of next generation systems which reduces risk and quickens time-to-market.
“Tektronix has a long-standing relationship with Intel that enables us to provide early test technology to them and throughout the computer industry value chain,” said Craig Overhage, Senior Vice President, Instruments Business, Tektronix. “The logic analysis technology that we have developed for testing the QuickPath interconnect has helped Intel and the licensees of this technology to accelerate their time to market.”
In addition to the QuickPath interconnect test demonstration in booth 740, Tektronix will be showing the latest test instruments and software for PCI-Express 1.x and 2.0 in booth 316.
About Tektronix
Tektronix is a leading supplier of test, measurement, and monitoring products, solutions and services for the communications, computer, and semiconductor industries — as well as military/aerospace, consumer electronics, education and a broad range of other industries worldwide. With 60 years of experience, Tektronix enables its customers to design, build, deploy, and manage next-generation global communications networks, advanced and pervasive technologies. Headquartered in Beaverton, Oregon, Tektronix has operations in 19 countries worldwide. Tektronix’ Web address is http://www.tektronix.com/.
Tektronix is a registered trademark of Tektronix, Inc. All other trade names referenced are the service marks, trademarks or registered trademarks of their respective companies.
Tektronix, Inc.
CONTACT: Gary Grossman of Tektronix, Inc., +1-503-627-1097,gary.grossman@tektronix.com
Web site: http://www.tektronix.com/