FlipChip International and Fujikura Ltd. Announce ChipletT(TM)/ ChipsetT(TM) Ultra Thin 3D Packages
PHOENIX, Nov. 10, 2011 /PRNewswire/ — FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications.
ChipletT and ChipsetT package products are based on Fujikura’s flex-based laminate embedded die technology “WABE Technology(TM)” and will provide breakthrough cost-effective, ultra low profile packages by leveraging roll to roll flex fabrication processes and technological extensions including 3D, System in Package, RDL, Fan-In, Fan-Out, TSV and NanoPillar(TM) options. Use of WABE Technology(TM) will enable ChipletT(TM) and ChipsetT(TM) body thicknesses in the sub 250um range, up to 50% less than alternative embedded die solutions.
FCI and Fujikura will be exhibiting this new Product line at the Productronica Show in Munich, Germany from Nov. 15th to 18th.
ChipletT(TM) and ChipsetT(TM) will service the +$22B semiconductor packaging market with targeted end markets of Smart Phones, Tablets, Medical Diagnostics, Advanced Server Farms, Automotive, Security, Sensors and Photovoltaics where ultra-thin and very low cost chip packaging enables innovative products and designs. ChipletT and ChipsetT provide a common package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density. The embedded flex based technology also delivers improved product reliability with improved system performance thereby conserving vital battery life.
Bob Forcier, FlipChip International CEO, said, “We are excited to announce ChipletT(TM) and ChipsetT(TM) to our customers and to the whole semiconductor industry”. We believe that the ChipsetT(TM) family of packages set a new standard in miniaturization and will be a game changer for portable devices that relentlessly seek thinner profiles, longer battery life and higher functionality.”
Takamasa Kato, Executive Vice President & Member of the Board of Fujikura, said, We believe that our “WABE Technology(TM)”, embedded die technology based on the extensive experience in flexible printed circuit technology, will deliver innovative and cost-effective solutions in this exciting area.
FlipChip International, LLC is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. FlipChip International is a recognized leader in WLCSP and flip chip bumping. FlipChip International, LLC is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets. For more information, visit www.flipchip.com and www.rosestreetlabs.com.
Fujikura Ltd. is a global supplier of optical transmissions systems, network systems, electronic materials, power systems, coated wires, magnet wires, electronic materials for equipment and metallic materials. For 120 years, Fujikura has been providing “Tsunagu” (connection) technologies. For more information, visit www.fujikura.com.
ChipletT(TM) and ChipsetT(TM) are trademarks of FlipChip International, LLC
WABE Techonology(TM) is a trademark of Fujikura Ltd.
SOURCE FlipChip International