Microsemi Announces Breakthrough Technology Platform for RF Front-end Modules
ALISO VIEJO, Calif., Jan. 10, 2012 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its breakthrough technology platform for 4G RF front-end modules (FEMs) based on silicon germanium (SiGe) technology. The company is already developing next-generation IEEE 802.11ac wireless LAN FEM on this innovative new platform. IEEE 802.11ac is now being referred to as fifth-generation WiFi or 5G WiFi by the industry.
Microsemi’s new platform integrates multiple filters, switches, LNAs and power amplifiers onto a single monolithic SiGe die, and supports multiple input/multiple output (MIMO) functionality. The high level of integration allows substantial reductions in cost and printed circuit board footprint, which are key considerations when designing devices such as smartphones and tablets.
“Microsemi has developed what we believe to be the world’s first silicon germanium-based, single-chip RF front-end module platform capable of meeting the stringent requirements of 4G applications while still offering space and cost-savings,” said Darcy Poulin, director of product engineering for Microsemi. “Moving forward, we will continue to innovate solutions that facilitate the growth of new industry standards such as IEEE 802.11ac.”
According to ABI Research, IEEE 802.11ac shipments will increase significantly in 2013 with 802.11ac emerging as the dominant Wi-Fi protocol by 2014. Industry research firm In-Stat estimates that nearly 350 million routers, client devices and attached modems with 802.11ac will ship annually by 2015, up from about 1 million units in 2012.
“The performance achieved with this platform is truly impressive and quite an accomplishment in the industry,” said Paul Pickle, senior vice president of Microsemi. “The first-of-its-kind digital tuning capability we have designed will reduce future development times and customization efforts as we engage our baseband partners. In addition, the performance achieved will enable Microsemi to drive innovation into the latest wireless LAN standard, IEEE 802.11ac, as well as the next-generation 4G mobile standard.”
Microsemi’s RF front-end-module includes two fully functional 2.5GHz IEEE 802.16 power amplifiers, two transmit/receive switches, two LNAs, two baluns, harmonic and noise shaping filters, and a digital interface for control and tuning. Its performance meets the strict 802.16 mask and EVM requirements at an output power of 24dBm in a 5×5.6mm package.
Microsemi’s next-generation wireless LAN dual-band FEM will be able to integrate highly linear 802.11ac compliant 2.4GHz and 5GHz PAs, 2.4 and 5GHz bypassable LNAs, switches, filters, a diplexer and an I2C digital interface into a tiny 3x4mm QFN package.
Microsemi is an established manufacturer in the wireless communications market with an extensive list of customers. The company has shipped more than 200 million RF integrated circuits to customer globally, predominantly for the wireless LAN market. Please visit www.microsemi.com for information on its RF IC portfolio.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and medical, alternative energy and industrial markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF ICs, ultra low-power radios, customizable SoCs, FPGAs and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
“Safe Harbor” Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new SiGe platform for RF front-end modules, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company’s products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company’s most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi’s future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation