Soitec and Sumitomo Electric Announce Major Milestone in Strategic Joint Development of Engineered Gallium Nitride Substrates
BERNIN, France, and TOKYO, January 24, 2012 /PRNewswire/ –
Soitec (Euronext), a world leader in generating and manufacturing revolutionary
semiconductor materials for the electronics and energy industries, and Sumitomo Electric
Industries, Ltd., a leading worldwide provider of compound semiconductor materials, have
reached a major milestone in their strategic joint development program started in December
2010 by demonstrating four- and six-inch engineered gallium nitride (GaN) substrates and
launching pilot production lines to enable wider market adoption. These substrates -
produced by transferring ultra-thin high quality GaN layers from a single GaN wafer to
produce multiple engineered GaN substrates – are ideally suited for manufacturing advanced
high-brightness light-emitting diodes (LEDs) for the lighting market and power-efficient
controllers for the electric vehicles and energy markets.
Leveraging Sumitomo Electric’s manufacturing technology for GaN wafers and Soitec’s
proven Smart Cut(TM) layer-transfer technology, this strategic alliance project had
originally produced two-inch wafers. With the successful demonstration of GaN wafers’
scalability, the partner companies are now proceeding with the next step to invest and
establish pilot production lines in Itami, Japan, and Bernin, France. The pilot lines will
initially fabricate four-inch wafers with six-inch wafer production to quickly follow to
support customers demand.
Sumitomo Electric will manufacture bulk free-standing GaN substrates in Japan for
shipment to France, where Soitec will apply its Smart Cut layer-transfer process to
generate the final engineered wafers with the same thermal expansion (CTE) as GaN wafers.
The resulting wafers have low defect density, enabling the manufacturing of advanced
semiconductor devices at lower costs than bulk GaN wafers.
“Our partnership’s successful demonstration of four- and six-inch engineered GaN
substrates’ scalability is a critical milestone, accomplished by applying very strong
innovative capabilities from both sides,” said Frederic Dupont, vice president of Soitec’s
Specialty Electronics Business Unit. “The advanced substrates we are developing will allow
the introduction of a new materials platform with novel and advanced functionalities.”
Yoshiki Miura, general manager of the Compound Semiconductor Materials Division at
Sumitomo Electric, said, “With layer-transfer technology’s production readiness now proven
for larger wafers, the substrates can be made even more cost effectively for large-volume
production. We look forward to continuing our successful collaboration with Soitec to
fulfill the requirements of the LED and energy markets, which represent amazing business
About Sumitomo Electric Industries, Ltd.
Sumitomo Electric Industries, Ltd. designs, manufactures and sells optical fibers,
cables, components, advanced electronic devices, and automotive parts. Through successful
strategies of research and diversification, Sumitomo Electric has become one of the
world’s leading companies at the forefront of the revolution in information and
communications. Sumitomo Electric’s world-class research and manufacturing capabilities in
optical technology continue to expand and strengthen the product portfolio while
maintaining industry-leading levels of reliability. The company has global operations in
more than 30 countries with over 180,000 employees. Sumitomo Electric reported group net
sales of $24 billion for the fiscal year ended March 2011. For more information about
Sumitomo Electric, visit the web site at http://global-sei.com.
Contact: Sumitomo Electric Industries, Ltd. Public Relations Department Tel: +81-6-6220-4119 (Osaka), +81-3-6722-3103 (Tokyo) E-mail: email@example.com
Soitec [http://www.soitec.com ] is an international manufacturing company, a world
leader in generating and manufacturing revolutionary semiconductor materials at the
frontier of the most exciting energy and electronic challenges. Soitec’s products include
substrates for microelectronics (most notably SOI: Silicon-on-Insulator) and concentrator
photovoltaic systems (CPV). The company’s core technologies are Smart Cut(TM), Smart
Stacking(TM) and Concentrix(TM), as well as expertise in epitaxy. Applications include
consumer and mobile electronics, microelectronics-driven IT, telecommunications,
automotive electronics, lighting products and large-scale solar power plants. Soitec has
manufacturing plants and R&D centers in France, Singapore, Germany, and the United States.
For more information, visit: http://www.soitec.com.
International Media Contact Camille Darnaud-Dufour +33(0)6-79-49-51-43 (any time zone) firstname.lastname@example.org Investor Relations Olivier Brice +33(0)4-76-92-93-80 email@example.com French Media Contact Marie-Caroline Saro H&B Communication +33(0)1-58-18-32-44 firstname.lastname@example.org
SOURCE Soitec Silicon