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Last updated on April 20, 2014 at 0:02 EDT

FlipChip International and NANIUM S.A. Announce License, Sales and Marketing Agreements for 300mm Wafer Level Packaging Services

March 6, 2012

PHOENIX and PORTO, Portugal, March 6, 2012 /PRNewswire/ — FlipChip International (FCI), the global technology leader in flipchip bumping and Wafer Level Packaging, and NANIUM S.A. (NANIUM), a world-class provider of manufacturing, test and engineering services in the semiconductor business, announced today License, Sales and Marketing agreements for 300mm flipchip bumping and Wafer Level Packaging.

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This strategic partnership will provide a platform for the promotion of the NANIUM 300mm Wafer Level Packaging services in addition to the existing FCI turnkey bump services for 150mm and 200mm wafers. As part of this alliance, NANIUM will be licensing the FCI Spheron® Plated Cu Redistribution technology.

Both companies will work closely with existing and new customers to offer the optimum technology for the particular demands of each application in the coming generations of packaging to be utilized in smart phones, medical devices, tablets, automotive integrated circuits, microprocessors, graphics processors, and wireless 3G and 4G integrated solutions.

Bob Forcier, FCI President and CEO, said, “This outstanding strategic partnership confirms the strong relationship between two internationally recognized semiconductor providers and also validates the global strategic importance of Wafer Level Packaging and flip chip bumping for next generation products, including smartphones and tablets. This alliance will also provide the market with the most complete global bumping and Wafer Level Packaging service in the industry.”

Armando Tavares, NANIUM President of Executive Board, said, “We are delighted with this opportunity to partner with FCI in this exciting technology. Wafer Level Packaging (WLP) is growing rapidly driven by smartphones, tablets and other high performance, space constrained applications. NANIUM is already a leader in 300mm FO-WLP eWLB packaging. With this addition of FCI based FI-WLP / WLCSP and wafer bumping technologies, NANIUM extends its portfolio to cover all major technologies in this growing market. Together, FCI and NANIUM offer a complete WLP service portfolio covering 150, 200 and 300mm wafer sizes.”

About NANIUM:

NANIUM is dedicated to provide package and system design, development, manufacturing, testing and engineering services in the semiconductor business, operating mainly in Wafer Level Packaging (WLP). NANIUM also offers package solutions based on laminated organic substrate and metal lead frame. With more than 15 years of experience in the semiconductor industry, NANIUM has a highly qualified, competent, well experienced and motivated team as well as state-of-the-art facilities and equipment, ready to provide services beyond its customer’s expectations.

About FCI:

FCI is a privately held supplier of products and services for the wafer bumping and wafer level packaging market. FCI is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for the semiconductor, renewable energy and life science markets.

    For information contact:

    Dawn Cuevas                 Irene Martins
    FlipChip International, LLC NANIUM S.A.
    #602-431-6637               Avenida 1 de Maio, nr. 801,
    dawn.cuevas@flipchip.com    4485-629 Vila do Conde,
    website: www.flipchip.com   Portugal
                                irene.martins@nanium.com
                                website: www.nanium.com

SOURCE FlipChip International


Source: PR Newswire