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NXP Expands Memory Options for Popular LPC1300 Family of USB Microcontrollers

March 23, 2012

New LPC1347 based on ARM Cortex-M3 processor offers 64 kB of eFlash memory.

Eindhoven, Netherlands and San Jose, CA (PRWEB) March 23, 2012

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of the LPC1347 microcontroller with Full-Speed USB and on-chip PHY based on the ARM® Cortex-M3 processor. The newest member of NXP´s popular LPC1300 series, the LPC1347 microcontroller features 64 KB of embedded Flash memory with 256 bytes of page erase, significantly enhancing the flexibility, efficiency and ease of use of the on-chip flash. LPC1347 also offers three power-profile APIs which enable the microcontroller to optimize power efficiency as low as 170 uA/MHz — a feature particularly useful for battery-operated applications. Along with other new members of the LPC1300 family, the LPC1347 introduces a 12-bit ADC and an I2C Fast-mode Plus (Fm+) interface up to 1 MHz, in addition to a smart card interface. The new microcontroller is ideal for sophisticated PC peripherals such as wireless speakers and gaming keyboards. Information on the LPC1300 series of microcontrollers is available at:

http://www.nxp.com/products/microcontrollers/cortex_m3/lpc1300/

New LPC1300 Microcontrollers

Other recent additions to the NXP LPC1300 series include the LPC1315, LPC1316 and LPC1317, as well as the LPC1345 and LPC1346 microcontrollers. Key features include:

  •     High performance up to 72 MHz with very low-power operation
  •     Up to 12 KB of SRAM, providing ample space for variables
  •     4 KB EEPROM, providing cost savings in bill of materials (BoM) for critical data storage
  •     High-speed communication, including Fast-mode Plus (Fm+) up to 1 MHz, for improved system performance
  •     12-bit successive approximation analog-to-digital (A/D) converter with 500 Ksps sample rate, enabling fast, accurate sensor measurement for improved system control
  •     Up to 51 GPIO pins, ideal for I/O-intensive applications
  •     Small, low-pin-count packages for space-constrained applications, including LQFP64, LQFP48 and HVQFN33

Availability

Samples of the LPC1345/46/47 and LPC1315/16/17 are available immediately from NXP and in distribution in April.

About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting http://www.nxp.com.

Forward-looking Statements

This document includes forward-looking statements which include statements regarding NXP´s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP´s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP´s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers´ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP´s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP´s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.

For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2012/3/prweb9321828.htm


Source: prweb



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