CEVA Continues to Dominate DSP IP Market with 90% Market Share
MOUNTAIN VIEW, Calif., May 14, 2012 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile handset, portable and consumer electronics markets, today announced that it has been ranked by leading research firm The Linley Group as the worldwide leader in DSP IP shipments in 2011, with a 90% market share. The market share numbers were published in The Linley Group’s recent report, titled ‘A Guide to CPU Cores and Processor IP’ (1).
“CEVA continues to be the most successful supplier of DSP IP — its licensees shipped more than one billion chips in 2011,” said J. Scott Gardner, an analyst at The Linley Group and co-author of A Guide to CPU Cores and Processor IP. “CEVA has an impressive customer base for its DSP portfolio, especially in communications and multimedia. Furthermore, with the 4G transition well underway, high-performance programmable DSPs are required to efficiently handle complex multimode baseband processing. CEVA is well positioned to capitalize on this trend.”
“CEVA is pleased to be ranked yet again as the worldwide leader in DSP IP by The Linley Group,” said Gideon Wertheizer, CEO of CEVA. “Our unrivalled expertise in DSP technology for high volume mobile and digital home applications drives our success and is the reason we are the DSP-of-choice for many of the world’s leading semiconductors and OEMs.”
CEVA’s industry-leading DSP cores power many of the world’s leading semiconductors today for a broad range of applications including cellular baseband, imaging, vision, audio, voice, voice-over-IP and more. Addressing every advanced wireless standard, including LTE-Advanced, Wi-Fi 802.11ac and DTV demodulation, CEVA’s latest generation communications DSP architecture framework, the CEVA-XC4000, sets a new milestone for power efficiency and utilizes an innovative instruction set to enable highly complex, software-based baseband processing. Likewise, the new CEVA-TeakLite-4 DSP architecture framework for advanced audio and voice processing introduces innovative smart power management technology and supports customer-owned extensions, making it a highly flexible architecture and ideal for even the most area and power sensitive designs.
Independent analysis of both the CEVA-XC4000 and the CEVA-TeakLite-4 DSP architecture frameworks was recently published in The Linley Group’s Microprocessor Report (2)(3). These reports are available at http://www.ceva-dsp.com/mpr.
(1) The Linley Group “A Guide to CPU Cores and Processor IP” by Kevin Krewell and J. Scott Gardner, April 2012.
(2) The Linley Group “Microprocessor Report – CEVA-TeakLite-4 Illuminates Roadmap, April 2012
(3) The Linley Group “Microprocessor Report – CEVA Exposes DSP Six Pack, March 2012
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA’s IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.