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Last updated on April 24, 2014 at 21:24 EDT

FlipChip International and Fujikura Ltd. Announce Strategic Business Agreement for ChipletT and ChipsetT Fan-Out and Fan-In 3D Semiconductor Packages.

June 12, 2012

PHOENIX, June 12, 2012 /PRNewswire/ — FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced conclusion of a Joint Strategic Sales and Business Development Agreement. This agreement will allow both parties to combine technology development, design, sales and marketing for their recently launched ChipletT(TM) and ChipsetT(TM) ultra low profile embedded semiconductor package product lines based on both the Fujikura’s WABE Technology(TM) and the WLCSP expertise of FCI. This is a further consolidation of the partnership between the companies and an important milestone in providing customers with industry leading supply chain logistics coupled with a seamless and efficient design to manufacture service.

This collaboration between FCI and Fujikura is another step towards a true turn-key service business model which provides the customer with improved design and commercial responsiveness, supply chain and yield management, consolidated design teams and reduced lead times for prototyping and production.

ChipletT and ChipsetT products will provide breakthrough low cost packages utilizing a FPC (Flexible Printed Circuit) format. ChipletT and ChipsetT will service the +$22B semiconductor packaging market with targeted end markets of Smart Phones, Tablets, Medical Diagnostics, Advance Server Farms, Automotive, Security, Sensors and Photovoltaics where ultra-thin and very low cost chip packaging enables innovative products and designs. ChipsetT(TM) provides a package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density. The embedded FPC based technology also delivers improved product reliability, system performance thus conserving vital battery life.

Flip Chip International, said, “We are excited to announce this partnership expansion with Fujikura. We believe that a true turn-key service provision is key for our customers and dramatically eases technology adoption, simplifies supply chain logistics and reduces time to market. Our goal is to deliver innovative, cost-effective packaging solutions that offer our customers real product value add coupled with outstanding reliability.”

Fujikura, said, “We strongly recognize that the tight partnership with FCI is the key for success in this business. We believe that the expansion of our partnership will provide a very useful one-stop solution for many of our customers in the semiconductor field.”

FlipChip International, LLC is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. FlipChip International is a recognized leader in WLCSP and flip chip bumping. FlipChip International, LLC is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets. For more information, visit www.flipchip.com.

Fujikura Ltd. is a global supplier of optical transmissions systems, network systems, electronic materials, power systems, coated wires, magnet wires, electronic materials for equipment and metallic materials. For 120 years, Fujikura has been providing “Tsunagu” (connection) technologies. For more information, visit www.fujikura.com.

CONTACT: Dawn Cuevas, +1-(602) 431-6637

SOURCE FlipChip International


Source: PR Newswire