FlipChip International Announces the Acquisition of Millennium Microtech Holdings Corporation and Controlling Interest in Millenium Microtech Shanghai
PHOENIX, July 9, 2012 /PRNewswire/ — FlipChip International – (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the acquisition of Millennium Microtech Holdings Corporation (MMH) of the Cayman Islands through a strategic Merger with FCI’s Cayman Island entity. FCI’s acquisition of MMH results in FCI securing controlling interest in Millennium Microtech (Shanghai) (MMS), located in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China. MMS is a leading semiconductor assembly and test business in China focused on high reliability, high voltage packages and complements FCI’s product and technology roadmaps.
FCI and MMS have enjoyed a strong relationship since the formation in 2006 of their 50/50 joint venture FlipChip Millennium Shanghai (FCMS), a pioneer firm in low cost, high reliability wafer bumping. This acquisition will expand and strengthen FCI’s global product turnkey offerings for the coming generations of packaging in the expanding smart phone, tablet, medical and automotive markets where miniaturization, low cost and high reliability is paramount. In acquiring the MMS product portfolio and extensive experience in electrical testing, FCI can now provide a complete range of back-end services which are synergistic with the existing mass production Wafer Level Packaging and flip chip services provided presently at FCMS.
Bob Forcier, FCI President and CEO, said, “We are excited about this acquisition being a key milestone in our long-term roadmap to further globalize our wafer level and FlipChip miniaturization products and services. This acquisition will provide our customers with dual product flows and improved logistics, enabling rapid cycle times and quicker time to market for our customers’ new products. It also enables the expansion of our FCI Asia Design, Packaging, Reliability Laboratories and Service portfolio for fast prototyping to secure design wins. There is a continued demand from our customers for leading design and technology for next generation miniaturization and multi-die 3D packaging in high growth products including smart phones, tablets, sensor networks, automotive, solid state lighting, and server infrastructure. Additional investments in FCI Asia are planned which will provide our customers with scalable wafer level bumping and flip chip solutions and innovative products such as our ChipletT(TM) product line to meet their rapidly changing needs.”
FCI is a privately held supplier of products and services for the wafer bumping and wafer level packaging market. FCI is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for the semiconductor, renewable energy and life science markets.
SOURCE FlipChip International