New Thermoreflectance Image Analyzer
SANTA CLARA, Calif., July 10, 2012 /PRNewswire/ — Microsanj announces the availability of a new high performance product in the Thermoreflectance Nanotherm Series. The NT220A, featured at the IPFA-2012 Conference in Singapore, adds near-Infrared capability to support Through-the-Substrate thermal imaging. This feature enables accurate high resolution thermal mapping and analysis of flip-chip assemblies. With a 1300 nm LED source, the NT220A provides micron spatial resolution at the active device layer with 1 degree Celsius thermal resolution.
“Commercializing the thermoreflectance technique for through-the-substrate imaging is a significant advance for microelectronic thermal characterization,” said Dr. Ali Shakouri, a co-founder of Microsanj, LLC and currently, Director of the Birck Nanotechnology Center and Professor of Electrical Engineering at Purdue University, “This additional capability gives engineers the ability to more accurately analyze thermal properties of flip chip assemblies leading to better performance and higher reliability.”
Pricing and Availability:
For NT220A product specifications, pricing, and availability contact Microsanj at firstname.lastname@example.org
Microsanj, LLC is a leading supplier of high resolution, Thermoreflectance Imaging Analysis (TIA) systems, tools, and consulting services. The TIA systems are based on the optical thermoreflectance principle coupled with digital signal processing and advanced patented software algorithms to support microelectronic component thermal characterization for thermal design validation, defect analysis, and reliability analysis. Microsanj currently offers the highest resolution thermal imaging systems on the market. For more information visit: www.microsanj.com