Open-Silicon To Present On 2.5D and 3D ASIC Design At Mentor Forum 2012 in Bangalore
MILPITAS, Calif., Aug. 23, 2012 /PRNewswire/ — Open-Silicon, Inc., a leading semiconductor design and manufacturing company, announced today that Hans Bouwmeester, senior director of Open-Silicon’s IP and ARM Center of Excellence, will be one of the keynote speakers at Mentor Forum 2012 in Bangalore, India. Mr. Bouwmeester’s presentation, “The Promise of 2.5D & 3D ASIC Design,” will address the many factors causing the ASIC market and design landscape to change rapidly. This keynote presentation will take a deeper look at the promise of new 2.5D and 3D technologies and what they bring to the ASIC development community.
What: Keynote Presentation – “The Promise of 2.5D & 3D ASIC Design”
Who: Presented by Hans Bouwmeester, Sr. Director of Open-Silicon’s IP Applications Engineering Department and ARM Center of Excellence
When: Friday, August 31, 2012
Where: Vivanta Hotels and Resorts by Taj, M.G. Road, 41/3, Mahatma Gandhi Road, Bangalore, Karnataka – 560 001, India
About Open-Silicon, Inc.
Open-Silicon is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. In support of the industry trend towards collaborative engineering and design-lite, Open-Silicon offers SoC architecture, system design, physical design, IP, system software, and high-quality semiconductor manufacturing services with one of the world’s broadest partner ecosystems for IC development. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.
SOURCE Open-Silicon, Inc.