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Last updated on April 16, 2014 at 16:55 EDT

GainSpan Extends Low-Power Wi-Fi Portfolio with New Connectorized Modules

September 5, 2012

SAN JOSE, Calif., Sept. 5, 2012 /PRNewswire/ — GainSpan(®) Corporation today announced it has expanded its low-power embedded Wi-Fi solutions portfolio with new connectorized Wi-Fi modules, the GS1011MExSC line. Comprised of the MEESC and the MEPSC, these new modules use a 40-pin connector which makes it easy to add Wi-Fi connectivity to an existing or new product, while providing the advantage of flexibility. With the connector, modules can be easily swapped, giving manufacturers flexibility in shipping devices with a PCB or external antenna depending upon the range required for the application.

(Logo: http://photos.prnewswire.com/prnh/20120305/SF63380LOGO-b)

The GS1011MExSC line features UART and SPI interfaces for ease of integration with any 8/16/32-bit microcontroller and an external power amplifier for extended range, with best-in-class +18dBm transmit power. They are fully certified for all major regulatory domains including FCC, IC, ETSI as well as TELEC in Japan.

“Connectorized designs are important to many customers around the world who want or need maximum flexibility,” said David Cohen, director of product management at GainSpan. “And, of course, they have been critical for Japanese device makers, where, until just recently, connnectorized designs were required by that country’s regulatory agency. We expect many Japanese customers will continue to develop connectorized products for the foreseeable future.”

Like all GainSpan Wi-Fi modules, the new GSMExSC products are preloaded with serial to Wi-Fi firmware for complete Wi-Fi functionality. They offer advanced networking features and capabilities not readily available with other Wi-Fi modules including easy provisioning from a smartphone, over-the-air firmware updates, enterprise security, embedded DHCP, DNS and HTTP(S) servers, an XML parser, advanced device discovery and more.

The connector-based GS1011MExSC line is the newest addition to GainSpan’s portfolio of Wi-Fi modules which include the soldered down GS1500M (802.11b/g/n), the ultra-low power GS1011MIx (802.11b), the size-optimized GS1011MIxS and GS1011MExS and the original connectorized GS1011MIC.

SKUs and Availability

The module line is available in two different SKUs. Other options may be offered in the future.

  • The GS1011MEPSC has a built-in PCB antenna.
  • The GS1011MEESC has a u.FL connector for an external antenna.

The modules are sampling now and will ship in volume production in late October. Customers will be able to purchase the modules at GainSpan’s online store or through GainSpan’s distributors.

About GainSpan Corporation

GainSpan is the leading semiconductor solutions company in low power Wi-Fi and Wi-Fi connectivity for the Internet of Things. Its easy-to-use system-on-chip (SoC), modules and software let customers leverage the large installed base of Wi-Fi access points and smartphones to create connected products for healthcare, smart energy and control/monitoring in industrial, commercial and residential markets. The solutions feature an ultra-low power SoC that consumes a few uA of standby current and goes from standby to active mode in a few ms. www.gainspan.com.

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Media Contact:
Carol Felton, Communications/PR
GainSpan
T | 408-807-3780
carol.felton@gainspan.com

SOURCE GainSpan Corporation


Source: PR Newswire