Jorjin Launches Next-Generation APM-5 Application Processor Module
MUNICH, Nov. 13, 2012 /PRNewswire/ — Electronica — Jorjin Technologies Inc, a leading supplier of system in package (SiP) and system on module (SoM) solutions based in Taipei, Taiwan, announces the latest in its range of application processor modules. The Jorjin APM-5 module family is based on the OMAP(TM) 5 platform from Texas Instruments Incorporated (TI), and contains the processor, memory, and power management functions in a single 35.5mm x 24mm x 2.8mm LGA module.
Jorjin’s application processor modules have been adopted in a range of products including thin client computing, rugged tablets and hand-held devices, mobile point of sale (PoS) and in-vehicle entertainment. This approach has several major advantages, including no high density routing, PCB layer count reduced from eight to four, and core hardware and software is pre-validated.
According to Jorjin CEO and General Manager, CC Huang, “We have a strong history of working with TI, both on wireless connectivity and on our application processor modules. Our OMAP 3 and OMAP 4 processor module customers are experiencing tremendous gains in product design speed and first-pass success. Several of our customers are transitioning from an x86 environment, and this new OMAP 5 processor-based module offers the performance they need at significantly reduced cost and power consumption. Our APM-5 lineup is our latest commitment to offering our customers with best-in-class, high-performance solutions.“
“As a leader in the Asia market now expanding into other regions, Jorjin has a strong understanding of specific design needs for developers across the globe,” said Michael Schoonover, industrial business development manager, OMAP platform business unit, TI. “Our TI team was proud to work with Jorjin to launch the new OMAP 5 processor-based APM-5 module, which leverages the ARM Cortex-A15 architecture to deliver the ultimate balance of high performance and low power for computing, point of sale, automotive and other markets.“
Jorjin has accelerated the module development by working together with key partners MM Solutions, SVTronics and Kozio. Jorjin is exhibiting their full range of application processor and wireless connectivity solutions at Electronica, Hall A4, Booth 417. The APM-5 module will available from Jorjin in volume from Q2 2013, with pricing to be announced.
Jorjin Technologies Inc was formed in 1997, initially as a distributor for high performance wireless ICs and materials. Since 2005, the company has been developing wireless system-in-package and system-on-module components, supporting a variety of standards including WLAN, Bluetooth, GNSS and Zigbee. Our mission is to ensure the successful execution of design to production of customer with Jorjin’s module solutions by leveraging extensive design experience and our continuing focus on our customers. Jorjin offers a “one-stop-shop” including peripheral devices, system application support, software drivers as well as arranging high volume assembly & tooling. In November 2010, the company was listed on the Emerging Market of the Taiwan Stock Exchange (stock code 4980)
About the Texas Instruments Design Network
Jorjin is a member of the TI Design Network, a premier group of independent, well-established companies that offer products and system-level design and manufacturing services complementing TI’s semiconductors to a worldwide customer base to accelerate product innovation and time-to-market. Network members provide product design, hardware and software system integration, turnkey product design, RF and processor system modules, reference platforms, software development, proof-of-concept design, feasibility studies, research, certification compliance, prototyping, manufacturing, and product life cycle management. For more information about the TI Design Network, please visit http://www.ti.com/designnetwork.
SOURCE Jorjin Technologies Inc