Broadcom Introduces Portfolio of Turnkey Designs to Accelerate 3G Smartphone Production
IRVINE, Calif., Dec. 4, 2012 /PRNewswire/ — News Highlights:
- Complete turnkey designs with support for single-, dual- and new concept quad-core (2+2) platforms and integrated cellular baseband, PMU and RFIC with advanced connectivity
- Flexible hardware selection and pre-certified software solutions for production of smartphones at lower cost
- Wide range of customization options enable OEMs to rapidly create feature-rich entry-market smartphones
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced three new turnkey solutions that enable OEMs to expedite production of 3G smartphones while lowering development costs. For more news, visit Broadcom’s Newsroom.
The new platforms are powered by HSPA and HSPA+ processors that have been proven on multiple carrier networks globally and include popular hardware components and software applications that have been tested and accepted by regional operator requirements. By refining the platforms to account for device variations and pre-qualifying hardware component vendors, Broadcom offers multiple customization options and reduces the time to market. This allows handset manufacturers to focus on developing value-added features and affordably deliver a quality Android experience, across multiple smartphone product tiers, in approximately three months or less.
As consumer demand for versatile features like touchscreen functionality, Wi-Fi and location-based services grows, the shift from 2G feature phones to more sophisticated 3G smartphones has accelerated. Analyst firm Ovum predicts that 1.7 billion smartphones will ship by 2017 and cites turnkey solutions by chipset and platform providers as a key factor in helping handset manufacturers meet market demand for entry-level smartphones.(1)
Broadcom’s turnkey solutions are optimized to provide native support for the rich and immersive experience of the Android 4.0 Ice Cream Sandwich and the Android 4.1/4.2 Jelly Bean operating systems (OSs). Powerful graphics and application processing capabilities enable OEMs to deliver a high-end multimedia experience in an entry-level device, while integration with Broadcom’s rich suite of wireless connectivity technologies, including Miracast and NFC, ensures consumers can take advantage of today’s most innovative applications.
- BCM21654G 1GHz ARM Cortex A9 based HSPA 720p video
- BCM21664T 1.2GHz Dual ARM Cortex A9 based HSPA+ 1080p video
- BCM28145/155 1.2GHz Double-Dual ARM A9 HSPA+ 1080p video
All three platforms are currently sampling to early access partners, with volume production expected in December.
Peter Cooney, Practice Director, Semiconductors at ABI Research
“The smartphone has become the portal for the Internet of everything, and as more connections are activated, so will the demand for superior smartphones that take advantage of the mobile Internet. By introducing turnkey designs to help handset manufacturers accurately meet the needs of consumers, Broadcom has strengthened its commitment to drive innovation at every tier of the market.”
Rafael Sotomayor, Vice President, Mobile Platform Solutions
“Broadcom’s processors already drive an enhanced user experience on Android smartphones worldwide, and we are committed to continuing to help our customers deliver timely, differentiated, and affordable products. Our turnkey platforms go beyond basic functionality by integrating advanced features previously reserved for high-end phones such as NFC, Wi-Fi direct, advanced multimedia performance, and imaging capabilities. With smartphone functions and features now integrated, our new turnkey platforms will enable OEMs to quickly scale and develop smartphones with competitive differentiators in three months or less and reach a new generation of consumers in emerging markets.”
(1)Ovum, Smartphones in Emerging Markets: Shifting Landscape, September 2012
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry’s broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.
Broadcom(®), the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.
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SOURCE Broadcom Corporation; BRCM Mobile & Wireless