Future Fab International Teams Up With SUNY NanoCollege’s Global 450 Wafer Consortium To Promote 450mm Wafer Processing
2013 Editorial Focus to Highlight 450mm Technology Story
San Francisco, CA (PRWEB) January 23, 2013
SAN FRANCISCO, Calif. — January 23, 2013 — Mazik Media, a provider of next-generation publishing solutions, including long-time semiconductor industry staple, Future Fab International, announced today a special collaborative agreement with the College of Nanoscale Science and Engineering (CNSE) of the University at Albany and the Global 450 Wafer Consortium (G450C), headquartered in New York State at CNSE, to deliver in depth technical articles and industry perspectives relating to 450mm process technology and manufacturing developments. As part of the non-exclusive agreement, Future Fab will feature 450mm special focus content written by G450C experts and technologists, and others working on the transition to the larger wafer size in each issue published this year.
Announced in September 2011 by New York Governor Andrew M. Cuomo, the $4.8 billion G450C is a first-of-its-kind collaboration housed at CNSE and comprised of five leading international companies working to create the next generation of computer chip technology: IBM, Intel, GlobalFoundries, Samsung, and TSMC. The consortium is leveraging industry and government investments with the state-of-the-art infrastructure at CNSE´s Albany NanoTech Complex to demonstrate and deploy 450mm wafer tools and process capabilities.
“We entered into this agreement with CNSE and G450C, the world´s first 450mm wafer consortium, because we want to incite a more engaged 450mm conversation,” commented Matt Grimshaw, Future Fab´s editorial director. “It´s time our industry focused the discussion on the enormous opportunities that 450mm adoption will bring. We see ourselves as the conversation starters here at Future Fab, we are hoping to open the doors and enlighten people as to the potential for 450mm to enable greater efficiencies and sustainability — changes generally only made when the industry transitions to a new wafer size. Working with representatives within the G450C will give us the necessary insight and direction to provide our readers with invaluable content on the subject throughout 2013 and beyond.”
With the help of CNSE Vice President for Manufacturing Innovation and G450C General Manager Paul Farrar, who will serve as G450C´s representative on our editorial board, Future Fab will solicit articles for the entire year dedicated to 450mm development, including technology updates, supply chain issues, process enhancements, materials, and news coming directly from the demonstration line which is set to be up and running at the College of Nanoscale Science and Engineering´s (CNSE) Albany NanoTech Complex.
“Guided by the pioneering vision and unparalleled leadership of Governor Andrew M. Cuomo, New York State is leading the global semiconductor industry´s transition to 450mm wafer technology through the G450C alliance headquartered at CNSE,” said Farrar. “This game-changing public-private partnership will play a critical role in delivering advanced technologies to fabricate devices, enhance processes, and introduce greener chemistries on the 450mm wafer platform, providing our corporate partners with a first-mover advantage in this revolutionary transition. We look forward to building on our partnership with Future Fab and serving as a focal point to help industry meet today´s challenges and maximize tomorrow´s opportunities during this exciting time.”
Future Fab will continue to highlight its customary, cutting-edge topics throughout the year, including its annual ITRS issue in January. Dedicated issues covering the 450mm development ecosystem will begin in April.
If you are interested in submitting a paper for Future Fab´s 2013 450mm special coverage or learning more, please contact Future Fab at 415-381-6800 or editorial (at) mazikmedia (dot) com.
The UAlbany CNSE is the first college in the world dedicated to education, research, development and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience and nanoeconomics. With more than $14 billion in high-tech investments, CNSE represents the world´s most advanced university-driven research enterprise, offering students a one-of-a-kind academic experience and providing over 300 corporate partners with access to an unmatched ecosystem for leading-edge R&D and commercialization of nanoelectronics and nanotechnology innovations. CNSE´s footprint spans upstate New York, including its Albany NanoTech Complex, an 800,000-square-foot megaplex with the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 85,000 square feet of Class 1 capable cleanrooms. More than 2,700 scientists, researchers, engineers, students and faculty work here, from companies including IBM, Intel, GlobalFoundries, SEMATECH, Samsung, TSMC, Toshiba, Applied Materials, Tokyo Electron, ASML and Lam Research. An expansion now underway, part of which will house the world´s first Global 450mm Consortium, will add nearly 500,000 square feet of next-generation infrastructure, an additional 50,000 square feet of Class 1 capable cleanrooms, and more than 1,000 scientists, researchers and engineers from CNSE and global corporations. In addition, CNSE´s Solar Energy Development Center in Halfmoon provides a prototyping and demonstration line for next-generation CIGS thin-film solar cells, supporting its leadership of the U.S. Photovoltaic Manufacturing Consortium (PVMC). CNSE´s Smart System Technology and Commercialization Center of Excellence (STC) in Rochester offers state-of-the-art capabilities for MEMS fabrication and packaging. CNSE also co-founded and manages operations at the Computer Chip Commercialization Center at SUNYIT in Utica and is a co-founder of the Nanotechnology Innovation and Commercialization Excelerator in Syracuse. For information, visit http://www.cnse.albany.edu.
About Future Fab:
Future Fab International, published by Mazik Media Inc., has been published for over 15 years. Future Fab was the first industry publication to go all-digital and the first industry publication to cover the entire manufacturing eco-system; design, fabrication and test/packaging. Future Fab International, its partners and industry revered editorial board continues to be the go to for leading edge information. The journal is free to view and with its corresponding website http://www.future-fab.com you will find over 1,500 leading technical articles written by the leading industry technologists.
For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2013/G450C/prweb10345258.htm