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Development Efforts and Architectural Enhancements: Long-term Investments on Robust Technologies – Research Report on Texas Instruments, Mellanox, Vishay, Cavium, and Integrated Device Technology

June 28, 2013

Editor Note: For more information about this release, please scroll to bottom.

NEW YORK, June 28, 2013 /PRNewswire/ –

Today, Wall Street Reports announced new research reports highlighting Texas
Instruments Inc. (NASDAQ: TXN), Mellanox Technologies, Ltd. (NASDAQ: MLNX), Vishay
Intertechnology Inc. (NYSE: VSH), Cavium, Inc. (NASDAQ: CAVM), and Integrated Device
Technology, Inc. (NASDAQ: IDTI). Today’s readers may access these reports free of charge -
including full price targets, industry analysis and analyst ratings – via the links below.

Texas Instruments Inc. Research Report

On June 7, 2013, Texas Instruments Inc. (TI) outlined its long-term strategy for
manufacturing facilities in Chengdu, China. The Company’s future plans include a new
assembly/test operation and the expansion of its existing wafer fabrication factory. TI
reported that its investments in these operations could total up to $1.7 billion over the
next 15 years and potentially include facilities, manufacturing equipment and land. “The
Chengdu Hi-Tech Zone has been an excellent location for TI’s manufacturing investments in
China. We believe this region offers significant benefits to TI and the more than 100,000
customers we serve,” said Kevin Ritchie, Senior Vice President of TI’s Technology &
Manufacturing Group. According to TI, this investment plan does not change its 2013
capital spending forecast, and hence the Company continues to expect capital spending
levels to remain at about 4% of revenue. The Company also said that if revenue exceeds $18
billion, the capital spending levels would then range between 4% and 7% of revenue over
the long term. The Full Research Report on Texas Instruments Inc. – including full
detailed breakdown, analyst ratings and price targets – is available to download free of
charge at: [http://www.wsreports.com/r/full_research_report/ce50_TXN]

Mellanox Technologies, Ltd. Research Report

On June 18, 2013, Mellanox Technologies, Ltd. (Mellanox) announced that the Company
continued its leadership as the global interconnect solution provider for the TOP500 list
of supercomputers. Mellanox reported that the number of the TOP500′s Petascale-capable
systems connected with Mellanox FDR InfiniBand doubled from November 2012 to June 2013.
According to the Company, the advanced offloads and accelerations within Mellanox
InfiniBand solutions enable the most performance-efficient systems on the TOP500 list, at
nearly 96% system and CPU efficiency. “We are pleased to see the increased adoption of our
FDR InfiniBand interconnect solutions by the world’s fastest supercomputers,” said Eyal
Waldman, President and CEO of Mellanox Technologies. “FDR InfiniBand delivers today the
highest performance for high-performance computing, cloud, Web 2.0, database and storage
applications. We continue with our development efforts to bring the next generation of
100Gb/s interconnect solutions, which are expected to be released in 2014/2015 time
frame.” The Full Research Report on Mellanox Technologies, Ltd. – including full detailed
breakdown, analyst ratings and price targets – is available to download free of charge at:
[http://www.wsreports.com/r/full_research_report/4da9_MLNX]

Vishay Intertechnology Inc. Research Report

On June 18, 2013, Vishay Intertechnology, Inc. (Vishay) introduced the industry’s
first thermal fuses to offer high current capabilities up to +160 degree(s)C for 1,000
hours without unexpected breakdown. The AEC-Q200 tested, devices in the new Vishay
Beyschlag HCTF series also provide a safety interrupt of electrical power in high-current
automotive applications. According to the Company, in the case of excess heat in the range
of the functioning temperature of +235 degree(s)C (+/- 15 K), HCTF thermal fuses open
automatically and disconnect the circuit. Vishay informed that typical applications for
HCTF devices include automotive power electronics that can be connected to steady battery
power (B+ or terminal number 30), such as control units of fans and pumps for liquid
engine cooling, inlet air control units, diesel pre-heaters, engine control units, ABS
control units, and diesel heater plugs relays. The Full Research Report on Vishay
Intertechnology Inc. – including full detailed breakdown, analyst ratings and price
targets – is available to download free of charge at: [

http://www.wsreports.com/r/full_research_report/2481_VSH]

Cavium, Inc. Research Report

On June 17, 2013, Cavium, Inc. (Cavium) reported that it has licensed and incorporated
Imagination Technologies’ latest Release 5 MIPS architecture (MIPSr5) features, including
hardware virtualization, in all members of its ultra-high-performance 1 – 48 core OCTEON
III family of products. Jim Whittaker, Executive Vice President (EVP) of Processor Group
at Imagination Technologies believes that Cavium has created some of the industry’s most
advanced 64-bit multi-core processors for networking, wireless and storage. M. Raghib
Hussain, Corporate VP/General Manager and Chief Technology Officer, Cavium, said, “The
MIPSr5 architecture enhancements from Imagination combined with Cavium’s in-house design
expertise will help create the most advanced MIPS 64-bit processor in the industry and
will serve to further extend our leadership in the network infrastructure market.” The
Full Research Report on Cavium, Inc. – including full detailed breakdown, analyst ratings
and price targets – is available to download free of charge at: [

http://www.wsreports.com/r/full_research_report/6759_CAVM]

Integrated Device Technology, Inc. Research Report

On June 17, 2013, Integrated Device Technology Inc. (IDT) announced that the IDT
CPS-1848 and CPS-1616 Gen 2 Serial RapidIO switches provide the key system interconnect
for the low-power BrownDwarf Supercomputer developed by nCore HPC and Prodrive. IDT said
that its RapidIO switches offer 20 Gbps throughput per port with the lowest latency and
the highest performance-per-watt compared to other interconnects. “RapidIO is key to the
multi-processor peer-to-peer processing needs that are emerging in both supercomputing and
data center applications,” said Tom Sparkman, Vice President and General Manager of the
Communications Division at IDT. “With the growth of processor-to-processor traffic in
these applications, IDT’s RapidIO switches bring the critical attributes of embedded
systems to offer improved system-level performance, throughput, latency, and energy
efficiency.” The Full Research Report on Integrated Device Technology, Inc. – including
full detailed breakdown, analyst ratings and price targets – is available to download free
of charge at: [http://www.wsreports.com/r/full_research_report/2dc9_IDTI]

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SOURCE Wall Street Reports


Source: PR Newswire