FlipChip International announces the Appointment of David Wilkie as President and Chief Executive Officer.
PHOENIX, Sept. 3, 2013 /PRNewswire/ — FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today the appointment of David Wilkie as President and Chief Executive Officer. A graduate of Edinburgh University, David Wilkie brings 23 years of engineering management experience to FCI including the last three years as Director of the Memory Products Division of Microchip Technology. The FCI committed strategy to provide engineering excellence in device miniaturization and innovation in Phoenix, AZ and extend the product process portfolio to the FCI Asia facility in Shanghai, China will be given extra momentum by this appointment.
David McComb who has been acting as interim President since the untimely passing of Bob Forcier in March of this year will resume his role as Senior VP of Global Sales and Marketing. Steve Sanghi, Acting CEO and Chairman of the Board of FCI will assume the role of non-executive Chairman of the Board.
Steve Sanghi said, “David Wilkie has a passion for leading an organization that develops successful and profitable products and technologies, and gets them to market quickly and cost effectively. David’s leadership will be critical to continue to profitably grow FCI into a global technology leader in flip chip bumping and Wafer level packaging.”
David Wilkie said “I am looking forward to joining the talented team at FCI, where I will provide expertise in a wide variety of disciplines to realize our Vision: Be the first choice for Flip Chip and Wafer Level interconnect solutions”.
FCI is a privately held supplier of products and services for the wafer bumping and wafer level packaging market from its facilities in Phoenix, USA and Shanghai, China.
SOURCE FlipChip International