Last updated on April 19, 2014 at 1:20 EDT

STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis

November 14, 2013

DUBLIN, November 14, 2013 /PRNewswire/ –

Research and Markets (
http://www.researchandmarkets.com/research/n8wd3c/stmicroelectronics) has announced
the addition of the “STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis”
[http://www.researchandmarkets.com/research/n8wd3c/stmicroelectronics ] report to their

http://photos.prnewswire.com/prnh/20130307/600769 )

System Plus Consulting is proud to publish the reverse costing report of the new 9-DOF
IMU supplied by STMicroelectronics.

The LSM333D is a 4x4mm system-in-package featuring a 3axisgyroscope
[http://www.researchandmarkets.com/research/n8wd3c/stmicroelectronics ], a 3-axis
accelerometer and a 3-axismagnetometer.

ST achieves to obtain this package footprint by combining the 3-axis gyroscope and the
3-axis accelerometer function on the same die. This new structure, combined with an Au-Au
hermetic bonding process allow ST’s to shrink the 6-axis function by more than 35%.

The LSM333D is targeted for portable applications: indoor navigation, smart user
interface, advanced gesture recognition, gaming and virtual reality input device It
provides accurate output across full-scale ranges up to plus or minus2000dps (rotational
acceleration), plus or minus16g (linear acceleration) and plus or minus12 Gauss (magnetic

This report provides complete teardown of the 9-Axis IMU with:

        - Detailed photos
        - Material analysis
        - Schematic assembly description
        - Manufacturing Process Flow
        - In-depth economical analysis
        - Manufacturing cost breakdown
        - Selling price estimation

Key Topics Covered:

        Overview / Introduction
        - Executive Summary
        - Reverse Costing Methodology

Companies Profile

        Physical Analysis
        - Package X-Ray
        - Package Opening
        - Package Cross-Section
        - ASICs Dimensions
        - ASICs Delayering
        - ASICs Cross-Section
        - MEMS Gyro/Accelero Dimensions
        - MEMS Gyro/Accelero Cap Opening
        - MEMS Gyro/Accelero Sensing Areas
        - MEMS Gyro/Accelero Cross-sections
        - X/Y-Axis Magnetometer Dimensions
        - X/Y-Axis Magnetometer Delayering
        - X/Y-Axis Magnetometer Cross-section
        - Z-Axis Magnetometer Dimensions
        - Z-Axis Magnetometer Delayering
        - Z-Axis Magnetometer Cross-section

        Manufacturing Process Flow
        - Front-End Manufacturing Process Flows
        - Description of the Wafers Fabrication Units
        - Back-End Packaging Process Flow
        - Back-End Packaging Assembly Unit

        Cost Analysis
        - Yields Hypotheses
        - ASICs Wafer Cost
        - ASICs Die Cost
        - MEMS Gyro/Accelero Wafer Cost
        - MEMS Gyro/Accelero Die Cost
        - X/Y-Axis Magnetometer Wafer Cost
        - X/Y-Axis Magnetometer Die Cost
        - Z-Axis Magnetometer Wafer Cost
        - Z-Axis Magnetometer Die Cost
        - Back-End: Packaging Cost
        - Back-End: Final test & Calibration Cost
        - LSM333D Component Cost (FE + BE 0 + BE 1)

        Estimated Price Analysis
        - Manufacturer Financial Ratios
        - LSM333D Estimated Selling Price

For more information visit


        Research and Markets
        Laura Wood, Senior Manager.
        U.S. Fax: +1-646-607-1907
        Fax (outside U.S.): +353-1-481-1716
        Sector: Telecommunications and Networks
         [http://www.researchandmarkets.com/categories.asp?cat_id=20&campaign_id=n8wd3c ]



SOURCE Research and Markets

Source: PR Newswire