Last updated on April 17, 2014 at 17:30 EDT

Reverse Costing Analysis Report on the Epcos D7005 Closed-Loop Antenna Tuner from the Japanese 4G Version of the Samsungs Galaxy SIII

November 14, 2013

DUBLIN, November 14, 2013 /PRNewswire/ –

Research and Markets (
http://www.researchandmarkets.com/research/j8pgj9/epcos_d7005) has announced the
addition of the “Epcos D7005 Closed-Loop Antenna Tuner Reverse Costing Analysis”
[http://www.researchandmarkets.com/research/j8pgj9/epcos_d7005 ] report to their offering.

http://photos.prnewswire.com/prnh/20130307/600769 )

The First Commercially Available Closed-Loop Antenna Tuner Which Supports All
Protocols (Gsm, Wcdma/Umts, Lte 700-2600Mhz) Extracted From The Japanese 4G Version Of The
Samsung Galaxy S III

Epcos began development using RF MEMS technology, but switched to GaAs technology for
their first antenna tuner.

With 4G being so widespread, the number of frequency bands needed becomes too large to
be handled by discrete components. Tunable components are the solution and Epcos is the
first to release a closed-loop antenna tuner which supports all protocols.

The D7005 antenna tuner is based on GaAs pHEMT technology, mixing Epcos and Sony

It is a compact multi-chip module integrating a switchable high-Q capacitors die
designed by Epcos and using Sony’s JPHEMT and MIMC processes. The module also integrates a
phase detector die designed by Epcos and manufactured with HBT transistors, a switch
controller die and a 8-bit microcontroller.

The D7005 antenna tuner [http://www.researchandmarkets.com/research/j8pgj9/epcos_d7005
] is targeted for mobile phones (especially 4G), tablets and data cards using single-feed
antenna structures.

This report provides a complete tear down of the antenna tuner with:

        - Detailed photos
        - Material analysis
        - Manufacturing Process
        - In-depth manufacturing cost analysis
        - Supply chain evaluation
        - Selling price estimation

Key Topics Covered:


1. Overview / Introduction

        2. Company Profile
        - TDK-EPC Profile
        - D7005 Characteristics

        3. Samsung Galaxy S3 Teardown
        - Samsung Galaxy S3 Progre Specifications
        - Samsung Galaxy S3 Progre Teardown

        4. D7005 Physical Analysis
        - Physical Analysis Methodology
        - Package
        - Capacitor Switch die
        - Phase Detector die
        - Switch Controller die
        - MCU die

        5. Cost Analysis
        - Synthesis of the Cost Analysis
        - Yields Hypotheses
        - Capacitor Switch Front-End Cost
        - Capacitor Switch Die Cost
        - Phase Detector Front-End Cost
        - Phase Detector Die Cost
        - Switch Controller Front-End Cost
        - Switch Controller Die Cost
        - MCU Front-End Cost
        - MCU Die Cost
        - Back-End: Packaging Cost
        - Back-End: Final test Cost
        - D7005 Component Cost (FE + BE)

6. Estimated Price Analysis

        - D7005 Estimated Manufacturer Price
        - D7005 Estimated Selling Price

For more information visit


        Research and Markets
        Laura Wood, Senior Manager.
        U.S. Fax: +1-646-607-1907
        Fax (outside U.S.): +353-1-481-1716
        Sector: Telecommunications and Networks
         [http://www.researchandmarkets.com/categories.asp?cat_id=20&campaign_id=j8pgj9 ]



SOURCE Research and Markets

Source: PR Newswire