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Bosch Sensortec BMC150 6-Axis MEMS eCompass Reverse Costing Analysis

March 13, 2014

DUBLIN, Ireland, March 13, 2014 /PRNewswire/ –

Research and Markets (
http://www.researchandmarkets.com/research/4z4lzz/bosch_sensortec) has announced the
addition of the “Bosch Sensortec BMC150 6-Axis MEMS eCompass Reverse Costing Analysis”
[http://www.researchandmarkets.com/research/4z4lzz/bosch_sensortec ] report to their
offering. <start_newscom>

(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The BMC150 combines a 12-bit 3-Axis accelerometer and a wide-range 3-Axis geomagnetic
sensor in a 2.2×2.2mm LGA package (the smallest footprint at its introduction). All the
functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction.
This reduction has been made possible by the integration of the second generation of Bosch
geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates
dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall
element for Z-Axis sensing. The MEMS accelerometer is also an evolution of the one found
in BMC050.

The BMC150 is a very low power (190microA) and high resolution (0.3microT) 6-axis
digital compass targeted for consumer mobile applications.

COMPLETE TEARDOWN WITH:

        - Detailed Photos
        - Precise Measurements
        - Material Analysis
        - Manufacturing Process Flow
        - Supply Chain Evaluation
        - Manufacturing Cost Analysis
        - Selling Price Estimation

Key Topics Covered:

Glossary

Overview/Introduction , Bosch Company Profile

Physical Analysis

        - Package

— Package Views, Dimensions & X-Ray
– Package Opening
– Wire bonding Process
– Package Cross-Section

        - Accelerometer ASIC Die

— View, Dimensions & Marking
– Process Identification
– Cross-Section

        - Accelerometer MEMS Die

— View, Dimensions & Marking
– Bond Pad Opening & Bond Pad
– Cap Removed & Cap Details
– Sensing Area Details
– Cross-Section (Sensor, Cap & Bonding)
– Process Characteristics

        - Magnetometer Die

— View, Dimensions & Marking
– Hall sensor and fluxgate sensors
– Delayering
– Main Blocks Identification
– Cross-Section (CMOS & Sensor)

        - Manufacturing Process Flow

— ASIC Accelero Front-End Process
– MEMS Accelero Process Flow
– Magnetometer Process Flow
– Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit

        - Cost Analysis

— Main steps of economic analysis
– Yields Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test & Dicing
– ASIC Wafer & Die Cost
– MEMS Front-End Cost
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Wafer & Die Cost
– Magnetometer CMOS Front-End Cost
– Magnetometer Sensor Cost
– Magnetometer Sensor Cost per process steps
– Magnetometer Back-End 0 : Probe Test & Dicing
– Magnetometer Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Final Test Cost
– BMC150 Component Cost

Estimated Price Analysis

For more information visit

http://www.researchandmarkets.com/research/4z4lzz/bosch_sensortec

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets


Source: PR Newswire



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