High Performance IC Footprint Probe to be Featured at International Microwave Symposium in June

April 28, 2014

Omniprobe-R technology proves to be a cost effective alternative to probe stations.

Tampa, Florida (PRWEB) April 28, 2014

Ardent Concepts of Seabrook, NH will be showcasing new versions of the Omniprobe-R IC footprint probe technology at the International Microwave symposium from June 1-6th at the Tampa Convention Center.

"Our customers are designing next generation ICs for advanced applications and increasing time to market by reducing channel parasitic measurement time is critical. With speeds ever increasing, fast, the requirement for effective ways to probe and de-embed reference design PCB’s and test boards have driven the need for this product," says Steve Cleveland, Vice President of Business Development. "Omnprobe-R gives them steppable access to all their channel pairs inside the IC footprint for probing without the need for expensive x-y tables and fragile planar probes. We are fortunate to offer a suite of products that allow them to put a coaxial cable connection right where they need it, providing time savings and cost savings without sacrificing signal integrity."

The new Omniprobe-R designs being introduced at IMS in Tampa is a step-able version which uses very simple mechanical fasteners to target the DUT footprint and access parallel high speed lanes accurately with excellent repeatable performance, giving engineers a reliable means of probing high speed I/Os on very tight pitch. Details on Omniprob-R are available at http://www.omniprobe-r.com and http://www.ardentconcepts.com.


Ardent Concepts designs and manufactures the most innovative signal integrity connector solutions on the planet. Ardent’s patented products are designed to change the way engineers think about high speed interconnect.

For the original version on PRWeb visit: http://www.prweb.com/releases/2014/04/prweb11797292.htm

Source: prweb

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