Opnext Introduces XFP With Increased Case Temperature Capabilities at FOE 2005
Posted on: Thursday, 20 January 2005, 09:00 CST
Enhanced 1310nm XFP Product Family Supports Highest Case Temperature on the Market; Provides High-Density Transmission and Pluggability for Telecom, Datacom and Storage Customers
Opnext, Inc., a global leader in high-performance optical components, today announced the addition of increased case temperature capabilities to the XFP 10G Serial Transceiver product family. With the addition of this product series, the TRF50x2, Opnext's XFP product family provides enhanced high-density transmission, pluggability and thermal design flexibility for telecom, datacom and storage customers.
The TRF50x2 product series is a 1310nm XFP capable of operating in the case temperature range from -5 degrees Celsius to 85 degrees Celsius. This reflects a case temperature improvement of up to ten degrees Celsius hotter than any conventional XFP available in the market. By supporting the 85 degrees Celsius case temperature, together with its very low power consumption of maximum 2.0W, this product will enable customers whose systems are space-constrained and have less thermal capabilities to benefit from a module that can not only withstand a higher case temperature but also enables higher density on a single board.
"As the industry moves to 10G, there is increased need to add multiple modules on a single line card or to fit the modules to very constrained space, resulting in higher ambient temperatures around the module," Hirokuni Tsuji, senior director of product marketing for Opnext. "The Opnext XFP meets our customers need by providing them increased flexibility to design their systems to enable higher density on a single board."
The Opnext XFP is XFP MSA compliant, Hot Z pluggable (pluggable though front panels of system equipment), includes an XFI electrical interface, and is capable of maintaining data rates up to 11.3Gbit/s utilizing TOSA with the state-of-the-art Opnext uncooled multiple quantum well (MQW) directly-modulated DFB LD chip with extremely high temperature operation capability. These same TOSA's can be used in 300pin, XENPAK and X2 modules.
Product samples of the TRF50x2 will be available in Q1 2005.
Opnext will be exhibiting at Fiber Optics Expo 2005, Tokyo Big Site, January 19 - 21. FOE is Asia's largest optical communications conference.
About Opnext
Opnext, Inc., pioneers the optical engines that light the world's fiber optic systems. A global leader in high-performance active optical components, Opnext offers the industry's most comprehensive optical components portfolio. Formed out of Hitachi, Opnext brings more than 30 years experience to the design, development and manufacture of high-performance components, opto devices and subsystems that power today's access communications, backbone, metro, information and industrial markets. Opnext provides world-class customer service, and has been recognized with multiple service awards. For additional information, visit www.opnext.com.
Source: Business Wire
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