IEC Wraps Up DesignCon 2008 With Record-Breaking Attendance From Design Engineers, Exhibitors and Media
Posted on: Friday, 15 February 2008, 15:00 CST
The International Engineering Consortium (IEC) wrapped up DesignCon 2008 last week with more than 5,000 registrants, 130 exhibitors and 80 media last week at the Santa Clara Convention Center in Santa Clara, CA with Agilent Technologies as the official host sponsor.
"The response we received to DesignCon 2008 last week from attendees, exhibitors and media is illustrative of quality of education our sessions and exhibition floor provide to design engineers," commented IEC President John Janowiak. "We are extremely grateful to all our exhibitors, major sponsors, speakers, Technical Program Committee members, media partners, associate partners, DesignVision judges and everyone involved in producing such a successful conference and exhibition."
Major sponsors of the event included Official Host Sponsor Agilent Technologies; Rambus; LeCroy; Tektronix; BERTScope; Amphenol; Cisco; Hewlett Packard; IBM; Intel; Redback Networks; Sun Microsystems; Xilinx; and Wipro.
Hundreds of design tools were showcased on the DesignCon 2008 exhibition floor, which included EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more. DesignCon 2008 brought box and board designers together with chip designers and everyone involved in system-level design.
The DesignVision Awards and DesignCon Paper Awards also took place at the event honoring outstanding contributions to the industry.
Co-located events included meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum also featured panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference.
For photos and complete wrap-up information, visit www.designcon.com/2008/ or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.
Source: Business Wire
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