TMC Announces Call for Papers for 2008 Communications Developer Conference in Los Angeles
Posted on: Wednesday, 2 April 2008, 09:00 CDT
Technology Marketing Corporation (TMC®), today announced a Call For Papers for the 5th annual Communications Developer Conference (www.commdeveloper.com). This year's event will be held September 16-18, 2008, at the Los Angeles Convention Center in Los Angeles, California.
Submissions can be sent for callforpapers@tmcnet.com. Deadline for submitting abstracts of educational sessions for the conference is Friday, April 18th.
The Communications Developer Conference focuses on educating developers interested in building the next generation of IP-based communications products and services. This event will have multiple concurrent tracks focusing on hardware and software development, SIP development, and other critical issues affecting the market.
"Communications Developer Conference attracts a loyal audience of developers eager to learn about the tools they can use to build the next great communications application," explained Rich Tehrani, president and group-editor-in-chief for TMC.
"This year's event will focus on areas like IP video, unified communications, SIP, and open source -- the areas offering the most promise for both developers and manufacturers of communications products and services," added Tehrani.
The Communications Developer Conference program is focused on subject areas like:
OCS integration
IBM Sametime integration
Asterisk integration
Designing for Communications Enabled Business Processes
iPhone Application Development
Developing for Google's Android Platform
Developing Rich Internet Applications
Software as a Service (SaaS)
Web 2.0
Developing for Windows Mobile
Wideband Codecs and HD Voice Development
Designing Applications Using DSPs (Echo Cancellation/Vocoder Design)
Developing Applications Using Host Processing Instead of DSPs
Designing Applications Using DSP Modules
Designing Applications Using DSP Resource Boards
Developing VoIP Devices
Next-Generation System on Chip Silicon
Open Source Design Considerations
Developing Wireless VoIP Solutions
Developing IMS-Compliant Gear
Developing Cable Telephony Solutions
Designing Consumer VoIP Products
Developing A Complete VoIP System
Building WiFi Telephony Devices
VoIP Enabling Legacy Products
Advanced TCA design considerations
High availability
Testing as part of the development process
Basics Of Protocols - SIP/H.323/MGCP
Echo Cancellation, Compression And Silence Suppression
Softswitch Architecture
Introduction to Development Tools - What's Out There To Help Develop?
Wireless VoIP Applications
Testing Tools
Open Source in VoIP Solutions
IP PBX Applications
Hosted Telephony Applications
Linux Telephony Applications
SIP
Peer To Peer IP Telephony Applications
Next-Generation Network Applications
High-Quality Voice Applications
Developing Applications Utilizing Presence and Availability
Service creation
Peer to Peer
Service Oriented Architecture
Unified Communications
For more information about speaking opportunities or exhibit and sponsorship options at Communications Developer Conference, please contact Dave Rodriguez at 203-852-6800, ext. 146. Or e-mail drodriguez@tmcnet.com.
About TMC®
Technology Marketing Corporation (TMC) publishes: Customer Interaction Solutions, INTERNET TELEPHONY, Unified Communications, and IMS Magazine. TMCnet, TMC's Web site, is the leading source of news and articles for the communications and technology industries. Ranked in the top 8,000 sites in the world by alexa.com(a), TMCnet serves nearly three million unique visitors each month and currently boasts more than 100 live sponsored communities. TMC is also the first publisher to test new products in its own on-site laboratories, TMC Labs. In addition, TMC produces INTERNET TELEPHONY Conference & EXPO, and Call Center 2.0 Conference. For more information about TMC, visit www.tmcnet.com.
(a) alexa.com is an amazon.com company that ranks Web sites by their traffic levels. Neither alexa.com nor amazon.com is affiliated with TMCnet.
Source: Business Wire
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