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Datacon Technology Joins EMC-3D Consortium to Develop Cost-Effective 3D Thru-Silicon-Via Interconnects

Posted on: Tuesday, 8 April 2008, 09:03 CDT

The international semiconductor equipment and materials consortium EMC3D today announced that Datacon Technology has joined the organization. EMC3D is dedicated to providing cost-effective integrated Thru-Silicon-Via (TSV) technology for chip stacking applications.

EMC-3D is addressing the technical, integration and economic issues of creating 3-D interconnects using TSV technology for chip stacking and advanced MEMS/sensors packaging. Through collaboration with research partners, the consortium will develop unit processes for creating micro-vias between 5 and 30 um on 50um thinned 200mm and 300mm wafers using via-first and die-to-wafer techniques. The primary goals of the consortium are to create a robust integrated process flow at a cost of less than $200USD per wafer.

Datacon provides die bonding and sorting equipment used in advanced assembly by the semiconductor and telecommunications industries. One of the key integration issues in 3D interconnect is the efficiency and accuracy of the die-to-wafer attach for both TSV and MEMS/sensor applications.

"One of the challenging integration issues of TSV is the die-to-wafer bonding and the cost associated with this step," said Markus Wimplinger, EMC3D board member and director of business unit technology development at EV Group. "Datacon will bring a significant expertise needed to achieve the aggressive goals of the EMC3D consortium."

About Datacon

Datacon Technology GmbH is a leading global manufacturer of die bonding & sorting equipment for the semiconductor, telecommunication and automotive industries. Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international group of companies operating in the semiconductor industry. Datacon's primary expertise is the development and production of high-precision assembly equipment for the advanced packaging market.

About EMC-3D (or EMC3D)

EMC3D (Semiconductor 3D Equipment and Materials Consortium) was created in October 2006 to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process for IC and MEMS/Sensor packaging.

www.EMC3D.org

Contacts for EMC3D Members include:

Equipment Members:

 Alcatel, France; (PARIS: CGEP) and (NYSE: ALA) Jean-Marc Gruffat, Director  of Business Development      Technology: Si and dielectric etching using DRIE Datacon Technology GmbH, Austria; Christoph Scheiring, Director Product    Marketing      Technology: Precision Diebonding & Sorting EV Group, Austria; Thorsten Matthias, Director of Technology North America      Technology: bonding, thin wafer handling, mask alignment lithography,       conformal coat and develop SEMITOOL Inc, USA; (NASDAQ: SMTL), Rozalia Beica, 3D Business and  Technology Director      Technology: electroplating, DOB, metal/barrier etch, photoresist       strip, wafer cleaning and thinning XSiL Ltd, Ireland; Dr. Alexey Rodin, Via Team Leader      Technology: Si laser machining, via drilling, and wafer dicing Isonics Corp, USA; (NASDAQ: ISON) Joanna Lohkamp, General Manager      Technology: wafer service (reclaim and test wafers, wafer thinning,       and thick-film SOI wafers) 

Materials Members:

 AZ Electronic Materials, USA; Aldo Orsi, Global Product Manager      Technology: positive and negative acting photoresists Brewer Science, Inc., USA; Laura Mauer, Associate Director of R&D Advanced  Technologies      Technology: Materials used in litho, wafer thinning, wafer etching and       anti-reflective coatings as well as spin-coat/develop/bake equipment. Enthone (Cookson Electronics), USA; Yun Zhang, Director, Research and  Development      Technology: chemistry for electroplating and metal etch Rohm and Haas, USA; Bob Forman, Advanced Packaging Business Manager      Technology: chemistry for lithography, plating, etching, dielectric       formation, and bonding 

Technology Members:

 CEA-LETI, Grenoble France; Mark Scannell, Microelectronics Program Manager Fraunhofer IZM, Germany; Juergen Wolf, Group and Project Manager KAIST (Korea Advanced Institute of Science and Technology), Korea;  Dr. Kyung-Wook Paik, Professor NXP, Dr. Fred Roozeboom, Technical Advisor SAIT (Samsung Advanced Institute of Technology), Korea; Dr. Yoon-Chul Sohn,  Researcher TAMU (Texas A&M University), USA; Dr. Manuel Soriaga, Professor 

 Contacts:  Datacon Technology GmbH Christoph Scheiring Director Product Marketing Diebonding & Sorting +43 5337 600-146 Email Contact  EMC-3D Paul Siblerud Vice President Semitool Inc 406.752.2107 Email Contact

SOURCE: Semitool

Source: MARKET WIRE

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