OmniVision Launches Backside Illumination Architecture

OmniVision Technologies, a supplier of CMOS image sensors, has launched its OmniBSI architecture.

OmniVision developed has OmniBSI architecture with the support of its long-time foundry and process technology partner, Taiwan Semiconductor Manufacturing (TSMC).

OmniVision has said that backside illumination (BSI) methodology involves turning the CameraChip sensor upside down so that it collects light through what was previously the backside of the sensor, the silicon substrate. This approach differs from conventional front side illumination (FSI) image sensors, where the amount of light reaching the photo-sensitive area is limited, in part, by the multiple metal and dielectric layers required to enable the sensor to convert photons into electrons.

Howard Rhodes, vice president of process engineering at OmniVision, said: “BSI allows OmniVision to further extend its competitive edge in digital imaging technology, while continuing the use of our production-proven, 0.11 micron process technology. This provides major cost and performance advantages for OmniVision and, ultimately, our customers.”